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Polymer Property : Melting Point = 166 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® CB301 Conductive Grade Acetal Resin
Conductive grade. Applications: Conductive products. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® EL306 Toughened Grade Acetal Resin
Flexible grade. Applications: Flexible products. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® GF705 G/F Reinforced Acetal Resin
Glass fiber reinforced, improved stiffnessApplications: Products for high stiffness, improved fatigue properties. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® MS301 Wear Modified Acetal Resin
Molybdenum disulfide added, improved wear property. Applications: Products for low noise and friction against metal. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 130 LS white POM Copolymer unreinforced, laser markable
POMInformation provided by BARLOG plastics GmbH.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 2027 POM Copolymer, 20% glass fiber reinforced
POM-GF20Information provided by BARLOG plastics GmbH.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 270 LS black POM Copolymer unreinforced, laser markable
POMInformation provided by BARLOG plastics GmbH.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 270.0 POM Copolymer unreinforced
POMInformation provided by BARLOG plastics GmbH.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 902 CF POM Copolymer, carbon fiber reinforced, electr. conductive
POM-CF10Information provided by BARLOG plastics GmbH.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 903 LF POM Copolymer unreinforced, improved wear and friction
POMInformation provided by BARLOG plastics GmbH.
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