Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Peel Strength | 0.859 kN/m | 4.90 pli | Copper adhesion; 4.0 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8 |
Rogers Corporation RO4450B Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent.. |
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Peel Strength | 0.859 kN/m @Temperature 85.0 °C |
4.90 pli @Temperature 185 °F |
95% RH; ASTM D1000 |
Parker Chomerics CHO-FOIL CCD Shielding Tape Conductive Adhesive Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or ti.. |
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Peel Strength | 0.859 kN/m @Temperature 85.0 °C |
4.90 pli @Temperature 185 °F |
95% RH; ASTM D1000 |
Parker Chomerics CHO-FOIL CCK Shielding Tape Conductive Adhesive Tin-plated Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, alum.. |