Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 1.28 GPa | 186 ksi | Storage |
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Tensile Modulus | 1.28 GPa | 186 ksi | 1 mm/min |
Arkema Group Rilsan® BESVO A FDA Nylon 11 (Conditioned) Designation ISO 1874-PA11,E,22-010Rigid grade for tubes and films extrusion in food applications. Available color: natural. Additive free.Good thermal and chemical resistance. Transparency. Barrier .. |
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Tensile Modulus | 1.28 GPa | 186 ksi | Conditioned 15 days at 23°C - 50% RH; ISO 527 |
Arkema Group Rilsan® PA 11 G BMNO MED Nylon 11 Rilsan® PA 11 G BMNO MED is a polyamide produced from a renewable source. This grade offers the highest quality and it is specially designed to meet the stringent requirements of the medical applic.. |