Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 6.39 GPa | 927 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP MX06402H PP LNP* THERMOCOMP* MX06402H is a compound based on Polypropylene resin containing 20% Glass Fiber. Added features of this material include: Heat Stabilized, Low Extractable. |
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Tensile Modulus | 6.39 GPa | 927 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP RX06420 PA 66 (Asia Pacific) LNP* Thermocomp* RX06420 is a compound based on Nylon 66 resin containing Glass Fiber. Added features of this material include: Easy Molding, Low Extractible, Mold Release. |
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Tensile Modulus | 6.39 GPa | 928 ksi | Storage |
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv.. |