Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 5.0172 GPa | 727.68 ksi | Storage |
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo.. |
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Tensile Modulus | 5.0172 GPa | 727.68 ksi | Storage |
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av.. |