Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 1.59 GPa | 230 ksi | |
Protective Coating PC-Rot Terminator® Epoxy Wood Consolidant Description: PC-Rot Terminator® is designed to strengthen decayed or rotted wood. The mixture is a low viscosity liquid that penetrates porous surfaces filling and sealing voids with an epoxy that .. |
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Compressive Modulus | 1.59 GPa | 230 ksi | TM R050-38 |
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
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Compressive Modulus | 1.59 - 5.24 GPa | 230 - 760 ksi | Average value: 3.49 GPa Grade Count:3 |
Overview of materials for Polyphenylene Sulfide (PPS) with 30% Carbon Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Polyphenylene Sulfide (PPS) with 30% Carbon Fiber Filler". Specific grades with carbon fiber content bet.. |
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Compressive Modulus | 1.59 GPa | 230 ksi | Stabilized, typ |
Hexcel® HexWeb® CR III 1/4-5056-.0025 Corrosion Resistant Specification Grade Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge."5052 and 5056 expanded aerospace grade aluminum honeycomb materials are available in a wide selection of cell sizes and foil gauges. The HexWeb CR.. |
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Compressive Modulus | 1.59 GPa | 230 ksi | Stabilized, typ |
Hexcel® HexWeb® CR-PAA™ 1/4-5056-0.0025 Phosphoric Acid Anodized Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge." The life cycle of aluminum honeycomb sandwich structures in a given application can be directly related to the quality of the bond between the fa.. |
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Compressive Modulus | 1.59 GPa | 230 ksi | ASTM D695 |
Ensinger Tecatron® XP-82 Compression Molded PPS Compound, Filled with 15% PTFE and 30% Carbon Fiber Ensinger Special Polymers has over twenty different grades of TECATRON PPS available. Custom formulations can be blended to suit specific applications. Compression molding is amenable to short run p.. |
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Compressive Modulus | 1.59 GPa | 230 ksi | TM R050-38 |
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |