Mechanical Properties | Metric | English | Comments |
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Compressive Strength | 51.7 MPa | 7500 psi | Ultimate; TM R050-38 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Compressive Strength | 51.7 MPa | 7500 psi | Break; TM R050-38 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Compressive Strength | 51.7 MPa | 7500 psi | Perpendicular to pressing direction |
Momentive Performance Materials HBC Hot-Pressed Boron Nitride Hot-pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom.. |
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Compressive Strength | 51.7 MPa | 7500 psi | |
Henkel Hysol EA 9309.3NA Paste Adhesive System Toughened adhesive with excellent peel strength. Contains glass beads for bond line control.Applications: Structural Repair Composite Bonding |
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Compressive Strength | 51.7 MPa | 7500 psi | Break; TM R050-38 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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Compressive Strength | 51.7 MPa | 7500 psi | Ultimate; TM R050-38 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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Compressive Strength | 51.7 MPa | 7500 psi | Ultimate; TM R050-38 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Compressive Strength | 51.7 MPa | 7500 psi | Break; TM R050-38 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |