Physical Properties | Metric | English | Comments |
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Thickness | 11.0 - 13.0 microns | 0.433 - 0.512 mil | Fired |
Lord Adhesives Metech 1130C Platinum Silver Conductor Composition This low cost, platinum silver conductor is designed for general hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense film that is resist.. |
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Thickness | 11.0 - 13.0 microns | 0.433 - 0.512 mil | Fired |
Lord Adhesives Metech 3524 Silver Conductor Composition This silver conductor composition is designed for screen printing applications requiring nickel barrier plating. It fires to a highly dense film which is resistant to acidic plating solutions.All in.. |
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Thickness | 11.0 - 13.0 microns | 0.433 - 0.512 mil | Fired |
Lord Adhesives Metech 3571 Silver Conductor Composition This high performance silver conductor is designed for cost sensitive hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film tha.. |
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Thickness | 11.0 - 13.0 microns | 0.433 - 0.512 mil | Fired |
Lord Adhesives Metech 3524D Silver Conductor Composition This silver conductor composition is designed for machine-dipped edge termination applications requiring nickel barrier plating. It fires to a highly dense film which is resistant to acidic plating .. |