Polymer Property : Viscosity = 4000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	4000 - 6000 cP	4000 - 6000 cP
ND Industries High Temperature SuperGlue 311 Very high viscosity with thermal cycling resistance
Viscosity	4000 cP	4000 cP
Resinlab® CYNERGY CA6014 Adhesive Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety..
Viscosity	4000 cP	4000 cP
Resinlab® CYNERGY CA6209 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP..
Viscosity	4000 cP	4000 cP	Part B (Polyol), RVT, #3, 20 rpm; TM R050-12
Resinlab® UR3001HP Black Urethane Encapsulant Resinlab™ UR3001HP Black is a black, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Black provides excellent e..
Viscosity	<= 4000 cP	<= 4000 cP	DIN EN ISO 3104
Lucobit LucowaxÂ® 1700 Polyethylene Wax Lucowax is a polyethylene wax additive for the modification of bitumen or asphalt.The addition of Lucowax reduces viscosity and penetration, while increasing water resistance, plasticity, and deform..
Viscosity	4000 cP @Temperature 25.0 Â°C	4000 cP @Temperature 77.0 Â°F
Momentive Performance Materials RTV615 Clear General Purpose Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
Viscosity	4000 - 6000 cP	4000 - 6000 cP	30% solid in Anone
Taiwan Sheen Soon SheenthaneÂ® A7710 TPU for Ink Thermoplastic polyurethane elastomer for ink. Hydrolysis resistance gradeAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen..
Viscosity	4000 cP	4000 cP	10% Solid, 1.5% NaCl
Solvay MACKADETÂ® EQ-178 Surfactant Product Description: Mackadet EQ-178 is a mild, concentrated blend of surfactants for use as a base for high foam personal care products. This blend is free of alcohol, diethanolamides, lauryl sulfa..
Viscosity	4000 cP	4000 cP	Mixed (cp #40, 2.5 rpm)
Tra-Con Tra-Bond 516H02 Fiber Optic Adhesive TRA-BOND 516H02 is a low viscosity, room temperature or low temperature curing fiber optic adhesive with good stress relief, high adhesion, and low shrinkage upon cure. TRA-BOND 516H02 contains very..
Viscosity	4000 cP @Temperature 25.0 °C	4000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond F123 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating sin..
Viscosity	4000 cP @Temperature 25.0 °C	4000 cP @Temperature 77.0 °F	Mixed (10 rpm)
Tra-Con Tra-Cast 3108 General Purpose Epoxy Casting Compound TRA-CAST 3108 is a low viscosity two-part formulation recommended for underfill and encapsulating applications where the combination of good mechanical thermal and electrical properties are required..
Viscosity	4000 - 8000 cP @Temperature 25.0 °C	4000 - 8000 cP @Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming Eccobond® B 97 Heat Cure Catalyst Emerson & Cuming B 97 Eccobond® Heat Cure CatalystVery high temperature resistance, not as brittle as 17 M 1. Cures from 80°C to 200°C. Excellent chemical resistance. May also be used as an accel..
Viscosity	4000 - 6000 cP @Temperature 23.0 °C	4000 - 6000 cP @Temperature 73.4 °F	50 rpm
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Viscosity	4000 - 7000 cP @Temperature 23.0 °C	4000 - 7000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in..
Viscosity	4000 - 5000 cP	4000 - 5000 cP
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I..
Viscosity	4000 cP	4000 cP	30% Toluene; NM 300-18
Dynasol Solprene® 1217 Solution Styrene-Butadiene Rubber (SSBR) Solprene1217 is a linear random-block styrene/butadiene copolymer having 25% of styrene content, 17.5% present as a polystyrene block. It has a non-staining antioxidant system, BHT/TNPP free, FDA ap..
Viscosity	4000 cP	4000 cP	uncured
Atom Adhesives AA-BOND F123 Epoxy Adhesive AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi..
Viscosity	4000 cP	4000 cP	"B" component
ACC QSil 550 QSI Quantum Silicones Silicone Potting Material QSil 550 is a 100% silicone solids elastomer designed for electrical potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab..
Viscosity	4000 cP	4000 cP	"A" component
ACC QSil 550 QSI Quantum Silicones Silicone Potting Material QSil 550 is a 100% silicone solids elastomer designed for electrical potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab..
Viscosity	4000 cP	4000 cP	"B" component
ACC QSil 550R QSI Quantum Silicones Silicone Potting Material QSil 550Ris a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab..
Viscosity	4000 cP	4000 cP	"A" component
ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair..
Viscosity	4000 cP	4000 cP	QSil 216A
ACC QSil 216 QSI Quantum Silicones Transparent Liquid Silicone Rubber QSil 216 is a two-part, clear, liquid silicone which will cure at room temperature or at elevated temperatures. It has a low viscosity, which allows for ease of flow around complex parts, providing ..
Viscosity	4000 cP	4000 cP	Part B (Polyol), RVT, #3, 20 rpm; TM R050-12
Resinlab® UR3001HP Clear Urethane Encapsulant Resinlab™ UR3001HP Clear is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Clear provides excellent e..
Viscosity	4000 cP @Shear Rate 230 1/s, Temperature 25.0 °C	4000 cP @Shear Rate 230 1/s, Temperature 77.0 °F	Haake Viscosity
Gwent Electronic Materials C2040226D4 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..