Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 14000 - 28000 cP | 14000 - 28000 cP | Part B |
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical.. |
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Viscosity | 22000 - 28000 cP @Temperature 23.0 °C |
22000 - 28000 cP @Temperature 73.4 °F |
10 rpm |
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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Viscosity | 22000 - 28000 cP @Temperature 23.0 °C |
22000 - 28000 cP @Temperature 73.4 °F |
10 rpm |
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |