Polymer Property : Viscosity = 3400 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	3400 - 4600 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	3400 - 4600 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2050517D1 Carbon Graphite Ink This is designed for screen-printing of working electrodes for electrochemical sensors. The paste is highly thixotropic which gives it very good definition on printing. This product has been design..
Viscosity	3400 - 7400 cP	3400 - 7400 cP	Unmilled Cement; Zeon Test #328
Zeon Chemicals Nipol® 1053 Nitrile Elastomer Nipol 1053 is a copolymer of butadiene and acrylonitrile with medium oil resistance. Sufficient non-staining antioxidant is added during manufacture for normal storage conditions.Used where low temp..
Viscosity	3400 cP @Temperature 25.0 °C	3400 cP @Temperature 77.0 °F
Trelleborg Emerson & Cuming EP651 Patch Paste Density matched brown adhesive for use with EP650 and TB650All information provided by Trelleborg Emerson & Cuming
Viscosity	3400 cP	3400 cP
Trelleborg Emerson & Cuming Stycast® 2057FR/11 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Viscosity	3400 cP @Temperature -20.0 °C	3400 cP @Temperature -4.00 °F
ConocoPhillips Hydroclear® 10W Fluid 10W Description: Conoco Hydroclear PowerDrive Fluid meets the stringent performance requirements of powershift transmissions, final drives, and wet-disc brakes typically found in equipment manufactured ..
Viscosity	3400 cP @Temperature -20.0 °C	3400 cP @Temperature -4.00 °F
ConocoPhillips Hydroclear® 60 Fluid Description: Conoco Hydroclear PowerDrive Fluid meets the stringent performance requirements of powershift transmissions, final drives, and wet-disc brakes typically found in equipment manufactured ..
Viscosity	3400 cP	3400 cP	A Component; Spindle #3; speed 10 rpm; ASTM D1824
Aptek 6110-A/B Epoxy Encapsulant and/or Potting Compound Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. More flexible, lower Tg version of APTEK 6106-A/B, for good temperature cycling in ceramic devices.P..