Physical Properties | Metric | English | Comments |
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Viscosity | 26000 - 34000 cP @Temperature 175 °C |
26000 - 34000 cP @Temperature 347 °F |
Automatic orifice Viscosity |
Cookson Group Plaskon® 3400F Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs .. |
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Viscosity | 26000 cP @Temperature 25.0 °C |
26000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV21 Pink General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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Viscosity | 26000 cP | 26000 cP | Mixed (rv #7, 10 rpm) |
Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive.. |
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Viscosity | 26000 cP @Temperature 25.0 °C |
26000 cP @Temperature 77.0 °F |
Mixed (rv #7, 10 rpm) |
Tra-Con Tra-Bond FS25 Information provided by Tra-Con Inc. |
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Viscosity | 26000 cP @Temperature 25.0 °C |
26000 cP @Temperature 77.0 °F |
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Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Viscosity | 26000 cP | 26000 cP | |
Dymax 912 Strain Relief, Wire and Parts Tacking Adhesive High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 912 Strain Relief, Wire and Parts Tacking AdhesiveFast curing, withstands wave soldering while resisting most solven.. |