- HOME
- POLYMER SEARCH
- Fluid
- Solvay SIPOMER® WAM II Composition Based On Methacrylamidoethyl Ethylene Urea
Solvay SIPOMER® WAM II Composition Based On Methacrylamidoethyl Ethylene Urea
| Category | Fluid |
| Manufacturer | Solvay |
| Trade Name | SIPOMER® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Solvay SIPOMER® WAM II Composition Based On Methacrylamidoethyl Ethylene Urea.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Description: Specialty monomer for Wet Adhesion PromotionIdentification: COMPOSITION BASED ON METHACRYLAMIDOETHYL ETHYLENE UREACAS: 3089 – 19 – 8Solubility: Total in water Polymer Test (10% in methanol): Limpid to slightly hazy, AN4021Inhibitor: HA/1800Available in: Asia Pacific, Europe, Latin America and North America Applications: Co-monomer in latex manufacturing. Improve the wet adhesion effect.Information provided by Rhodia, Rhodia has been acquired by Solvay.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.11 g/cc | 0.0401 lb/in³ | |
| Volatiles | <= 57 % | <= 57 % | |
| pH | 2.0 - 5.0 | 2.0 - 5.0 | 10% aq. Sol.; AN3401 |
| Viscosity | 20 cP | 20 cP | |
| Molecular Weight | 197 g/mol | 197 g/mol |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Crystallization Temperature | -15.0 °C | 5.00 °F | |
| Boiling Point | 100 °C | 212 °F | |
| Glass Transition Temp, Tg | 87.0 °C | 189 °F | |
| Flash Point | >= 100 °C | >= 212 °F |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Moisture Content | 24.5 - 28.5 % | 24.5 - 28.5 % | AN3150 |
| Shelf Life | 12.0 Month | 12.0 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Appearance | Thick liquid | |
| Composition | AEEU | <3%, AN3372 |
| Hydroquinone | 0.15-0.25%, AN7013 | |
| MAEEU | 46-50%, AN7045 | |
| Methacrylic acid | 22.5-26%, AN3371 |
Users viewing this material also viewed the following:
- Rogers Corporation Theta® MCL-HE-679G Laminate, GHA-679G Prepreg Halogen-Free, Low Dielectric Constant, High heat Resistant Multi-Layer Circuit Material
- LNP Thermocomp® OF-1006 Polyphenylene Sulfide, Glass Fiber Reinforcement (discontinued **)
- Plastics Group Polifil® RMC-20 20% Calcium Carbonate-Reinforced Polypropylene, High Impact
- Formosa Plastics Formolene® L62009A Film (Hexene Grade) LLDPE
- Goodfellow Nickel 80/Iron 20 Alloy
- ATI Allvac® Nickelvac® K-500 UNS N05500 Nickel Superalloy
- Akro-Plastic Akromid® A3 4 S1 PA, Cold-Impact Resistant (discontinued **)
- Fainplast Compounds PM 65/7 Flexible PVC, Lead Free
Copyright © lookpolymers.com All Rights Reserved