Dymax 9001v3.0 Low Modulus Clear Microencapsulant

Category	Polymer , Adhesive , Thermoset
Manufacturer	Dymax Corporation
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Dymax 9001v3.0 Low Modulus Clear Microencapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9001v3.0 Low Modulus Clear MicroencapsulantLowest stress potting and encapsulation on ceramic, FR-4 or flexible PCBs as well as flip chip, IC cards and other high flow applications Cure Type: UV/Visible Typical Use: High flow for IC cards and flip chip assembly

Physical Properties	Metric	English	Comments
Viscosity	400 cP	400 cP

Optical Properties	Metric	English	Comments
Transmission, Visible	90 %	90 %	clear; thickness not quantified

Processing Properties	Metric	English	Comments
Cure Time	0.0333 - 0.167 min	0.000556 - 0.00278 hour	10-20 mil thick layers cured with Dymax 5000-EC at 2 inches. Thicker layers may require more cure time.

Descriptive Properties	Value	Comments
Color	Clear

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