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Dymax 9001v3.0 Low Modulus Clear Microencapsulant

Category Polymer , Adhesive , Thermoset
Manufacturer Dymax Corporation
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Dymax 9001v3.0 Low Modulus Clear Microencapsulant.pdf
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Material Notes:
High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9001v3.0 Low Modulus Clear MicroencapsulantLowest stress potting and encapsulation on ceramic, FR-4 or flexible PCBs as well as flip chip, IC cards and other high flow applications Cure Type: UV/Visible Typical Use: High flow for IC cards and flip chip assembly
Physical Properties Metric English Comments
Viscosity 400 cP
400 cP
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Processing Properties Metric English Comments
Cure Time 0.0333 - 0.167 min
0.000556 - 0.00278 hour
10-20 mil thick layers cured with Dymax 5000-EC at 2 inches. Thicker layers may require more cure time.
Descriptive Properties Value Comments
Color Clear
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