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3M Scotch-Weld™ DP270 Black Structural Adhesive
| Category | Polymer , Adhesive |
| Manufacturer | 3M |
| Trade Name | Scotch-Weld™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | 3M Scotch-Weld™ DP270 Black Structural Adhesive.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Rigid potting compound, Non-corrosiveInformation provided by 3M
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 6000 - 12000 cP | 6000 - 12000 cP | Accelerator |
| 7000 - 16000 cP | 7000 - 16000 cP | Base | |
| 12000 cP | 12000 cP |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 83 | 83 | ASTM D2240 |
| Compressive Strength | 55.8 MPa | 8100 psi | ASTM D695-68T |
| Shear Strength | 2.07 MPa @Temperature 82.0 °C |
300 psi @Temperature 180 °F |
Overlap |
| 2.07 - 2.41 MPa @Temperature 82.0 °C |
300 - 350 psi @Temperature 180 °F |
Overlap Al/Al (etched); ASTM D1002-72 | |
| 8.27 MPa @Temperature -55.0 °C |
1200 psi @Temperature -67.0 °F |
Overlap | |
| 8.27 - 8.62 MPa @Temperature -55.0 °C |
1200 - 1250 psi @Temperature -67.0 °F |
Overlap Al/Al (etched); ASTM D1002-72 | |
| 11.7 - 12.1 MPa @Temperature 23.0 °C |
1700 - 1750 psi @Temperature 73.4 °F |
Overlap Copper/Copper (MEK Wiped); ASTM D1002-72 | |
| 12.1 - 12.4 MPa @Temperature 23.0 °C |
1750 - 1800 psi @Temperature 73.4 °F |
Overlap FR-4/FR-4 (MEK Wiped); ASTM D1002-72 | |
| 16.9 - 17.2 MPa @Temperature 23.0 °C |
2450 - 2500 psi @Temperature 73.4 °F |
Overlap Al/Al (etched); ASTM D1002-72 | |
| 17.2 MPa @Temperature 24.0 °C |
2500 psi @Temperature 75.2 °F |
Overlap | |
| Peel Strength | <= 0.351 kN/m | <= 2.00 pli | 90° T-Peel, Alum/Alum; ASTM D1876-61T |
| 0.351 kN/m | 2.00 pli | T-Peel |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 80.0 µm/m-°C @Temperature 5.00 - 30.0 °C |
44.4 µin/in-°F @Temperature 41.0 - 86.0 °F |
Below Tg |
| 180 µm/m-°C @Temperature 60.0 - 125 °C |
100 µin/in-°F @Temperature 140 - 257 °F |
Above Tg | |
| Thermal Conductivity | 0.177 W/m-K @Thickness 6.35 mm, Temperature 43.3 °C |
1.23 BTU-in/hr-ft²-°F @Thickness 0.250 in, Temperature 110 °F |
|
| Glass Transition Temp, Tg | 43.0 °C | 109 °F | Onset |
| 49.0 °C | 120 °F | Mid-point |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 4.10e+14 ohm-cm | 4.10e+14 ohm-cm | ASTM D257 |
| Insulation Resistance | 2.00e+11 ohm | 2.00e+11 ohm | 1000 hrs |
| 3.00e+13 ohm | 3.00e+13 ohm | Initial | |
| Dielectric Constant | 3.5 @Frequency 1000 Hz |
3.5 @Frequency 1000 Hz |
ASTM D150 |
| Dielectric Strength | 33.5 kV/mm | 850 kV/in | ASTM D149 |
| Dissipation Factor | 0.018 @Frequency 1000 Hz |
0.018 @Frequency 1000 Hz |
ASTM D150 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 180 min | 3.00 hour | Time to Handling Strength |
| 2880 min | 48.0 hour |
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