Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | |
Premix Thermoplastics PRESEAL 6070 Ag-Coated Glass Metal replacement is one of the fastest growing areas for conductive plastics. Plastics, with their lighter weight, good processability and optimal combination of mechanical properties have challeng.. |
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Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | |
Premix Thermoplastics PRESEAL 6070 Ag-Coated Glass Highly conductive PRESEAL® thermoplastic elastomer compounds are injection-mouldable and extrudable plastics for EMI-gasket and -housing applications, among other uses. The material is an ideal cho.. |
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Volume Resistivity | <= 0.0030 ohm-cm | <= 0.0030 ohm-cm | ISO Mil-G-835388 |
Premix Thermoplastics PRESEAL® TPE 6070 PRESEAL TPE 6070 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasketing and grounding applications. Conductivity is achieved with a silver coated glass sp.. |
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Volume Resistivity | <= 0.0030 ohm-cm | <= 0.0030 ohm-cm | ISO Mil-G-835388 |
Premix Thermoplastics PRESEAL® TPE 6071 PRESEAL TPE 6071 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasketing and grounding applications. Conductivity is achieved with a silver coated glass sp.. |
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Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | Chomerics MAT-1002 |
Parker Chomerics CHO-FORM 5526 EMI Shielding Material Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | Cured property; ASTM D257 |
Aptek 2313-PMF Hybrid Epoxy Adhesive Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s.. |
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Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | Initial; Chomerics MAT-1002 |
Parker Chomerics CHO-FORM 5531 EMI Shielding Material One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed.. |
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Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | Cured: 8 hours at 25°C |
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit.. |