Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 60093 |
3M Dyneon™ TF 2021 PTFE
(discontinued **) Processable by standard paste extrusion methodsBoth grades can be processed at low to medium reduction ratiosTF 2021 PTFE is preferred for unsintered thread sealing tapes and expanded joint sealants.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 60093 |
3M Dyneon™ TF 2025 PTFE
(discontinued **) Processable by standard paste extrusion methodsBoth grades can be processed at low to medium reduction ratiosTF 2021 PTFE is preferred for unsintered thread sealing tapes and expanded joint sealants.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 60093 |
3M Dyneon™ TF 2029 PTFE
(discontinued **) Processable by standard paste extrusion methodsDesigned for low reduction ratiosCan be processed at a high stretch ratiosRecommended for apes requiring high mechanical strength, such as electrical t.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 60093 |
3M Dyneon™ TF 2071 PTFE
(discontinued **) Processable by standard paste extrusion methodTF 2071 and TF 2072 have a wide processing range because of high maximum allowable reduction ratioTF 2071 is recommended for high quality tubing and wir.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 60093 |
3M Dyneon™ TF 2072 PTFE
(discontinued **) Processable by standard paste extrusion methodTF 2071 and TF 2072 have a wide processing range because of high maximum allowable reduction ratioTF 2072 is recommended for thin-wall, small diameter t.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | DIN 53482 |
Isoflon PMMA Polymethyl-methacrylate Products with good mechanical performances under friction and good dimensional stability, notably in moist environmentsVery rigid, hardHigh machining precisionInformation provided by Isoflon. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 60093 |
Lanxess Durethan® DP 2325 H3.0 000000 Nylon 66 PA 66, injection molding grade, non-reinforced, elastomer-modified, good heat-ageing resistance, extremely high notched impact strength even at dry state and at low temperatures |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | IEC 93 |
Wolf Kunststoff ZEDEX® ZX-550 A5L Polymer Alloy Main Characteristics: Strong anti-adhesive; Low creep; Weather resistant; No water absorption; Good machinability; Strongly viscoelastic; Stress resistantApplications: Chemical Engineering; Laborato.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 3022-35 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 3022-46 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 3022-57 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 3022-63 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 4022-35 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4022-35 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 4024-40 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4024-40 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ 4026-46 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4026-46 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ XU35075 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35075 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ XU35132 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35132 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Volume Resistivity | 1.00e+19 ohm-cm | 1.00e+19 ohm-cm | |
Dow CYCLOTENE™ XU35133 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35133 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |