Processing Properties | Metric | English | Comments |
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Melt Temperature | 90.0 - 100 °C | 194 - 212 °F | Injection molding |
Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l.. |
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Melt Temperature | <= 90.0 °C | <= 194 °F | |
Kazanorgsintez NMPE-1 Low-Molecular Polyethylene Low-molecular polyethylene of high pressure polyethylene production. Application: Designed for use in the rubber industry, building industry, and other fields. Can also be used as component parts.. |
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Melt Temperature | 90.0 - 105 °C | 194 - 221 °F | |
Kazanorgsintez NMPE-3 Low-Molecular Polyethylene Notes: Low-molecular polyethylene of high pressure polyethylene production. Application: Designed for use in the rubber industry, building industry, and other fields. Can also be used as compon.. |
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Melt Temperature | 90.0 - 150 °C | 194 - 302 °F | |
Huntsman KRYSTALFLEX® PE 501 Polyurethane Optical Aliphatic Film Key Properties:Moisture ResistanceChemical CompatibilityCooler ProcessingHigher AdhesionMultiple Design OptionNo special storage requiredInformation provided by Alliance Polymers |
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Melt Temperature | 90.0 - 140 °C | 194 - 284 °F | |
Huntsman KRYSTALFLEX® PE 900 Polyurethane Optical Aliphatic Film Key Properties:Moisture ResistanceChemical CompatibilityCooler ProcessingHigher AdhesionMultiple Design OptionNo special storage requiredInformation provided by Alliance Polymers |
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Melt Temperature | 90.0 - 100 °C | 194 - 212 °F | Injection molding |
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U.. |