Processing Properties | Metric | English | Comments |
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Shelf Life | 12.0 Month @Temperature 21.0 °C |
12.0 Month @Temperature 69.8 °F |
Bi-Paks; from date of Manufacture |
Parker Chomerics CHO-BOND 584-208 Conductive Adhesive Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m.. |
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Shelf Life | 12.0 Month @Temperature 21.0 °C |
12.0 Month @Temperature 69.8 °F |
Bi-Paks; From date of manufacture |
Parker Chomerics CHO-BOND 584-29 Conductive Adhesive Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m.. |
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Shelf Life | 12.0 Month @Temperature 21.0 - 27.0 °C |
12.0 Month @Temperature 69.8 - 80.6 °F |
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Lord Adhesives 320 / 322 Epoxy Adhesive LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides .. |
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Shelf Life | 12.0 Month @Temperature 21.0 - 27.0 °C |
12.0 Month @Temperature 69.8 - 80.6 °F |
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Lord Adhesives 320 / 322 Epoxy Adhesive LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides .. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
309-1D Resin |
Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adh.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
309-2D Hardener |
Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adh.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
310A Resin |
Lord Adhesives Fusor® 310 A/B Epoxy Adhesive Lord® 310 adhesive is a modified, thixotropic, two-part epoxy adhesive which bonds well to many types of prepared metals, prepared rubber, urethane, and plastics. Originally formulated for primer.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
310B Hardener |
Lord Adhesives Fusor® 310 A/B Epoxy Adhesive Lord® 310 adhesive is a modified, thixotropic, two-part epoxy adhesive which bonds well to many types of prepared metals, prepared rubber, urethane, and plastics. Originally formulated for primer.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
Hardener |
Lord Adhesives Thermosetâ„¢ EP-830 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-830 is a heat curing, two component epoxy formulation designed especially for use in automotive high voltage ignition coils where adhesion to segmented bobbins is critical. The combination o.. |
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Shelf Life | 12.0 Month @Temperature 4.00 °C |
12.0 Month @Temperature 39.2 °F |
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Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
Hardener |
Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive This is a system with the versatility to fit a wide variety of production and performance needs. The working life allows sufficient time for short production interruption. It can be initially cured .. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
In Kits |
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi.. |
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Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
PMF |
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
In Kits |
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
PMF |
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
In Kits |
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
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Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
PMF |
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
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Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
In Kits |
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such .. |
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Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
PMF |
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such .. |
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Shelf Life | 12.0 Month @Temperature -18.0 °C |
12.0 Month @Temperature -0.400 °F |
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Hexcel® HexPly® 8551-7 Epoxy Matrix, Carbon Tape Form Information provided by HexCel |
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Shelf Life | 12.0 Month @Temperature -18.0 °C |
12.0 Month @Temperature -0.400 °F |
Guaranteed |
Hexcel® HexPly® M14 248°F (120°C) Curing Epoxy Matrix HexPly® M14 is a modified epoxy resin which provides good adhesion to honeycomb and foam cores. Its self-extinguishing characteristics meet the fire, smoke, and toxicity requirements of aerospace a.. |
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Shelf Life | 12.0 Month @Temperature -18.0 °C |
12.0 Month @Temperature -0.400 °F |
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Hexcel® HexPly® M27 248°F (120°C) Curing Epoxy Matrix HexPly® M27 is specifically designed for applications with fast curing cycles. It is ideally suited for high volume production techniques-in particular for ski manufacture. HexPly® M27 has been sp.. |
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Shelf Life | 12.0 Month @Temperature -18.0 °C |
12.0 Month @Temperature -0.400 °F |
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Hexcel® HexPly® M39-X7B Epoxy Matrix HexPly® M39-X7B is specifically designed for prepreg applications with unidirectional fibers and short curing cycles for sporting (e.g. racket production) and industrial applications. HexPly® M39-.. |
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Shelf Life | 12.0 Month @Temperature 23.0 °C |
12.0 Month @Temperature 73.4 °F |
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Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
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Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |