Polymer Property : Cure Time = 0.00556 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Steel, handling time
Permabond 240 Cyanoacrylate, gap filling PERMABOND® 240 is a high viscosity product useful in large gap applications. It is ideal for porous substrates. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Steel, handling time
Permabond 920 Cyanoacrylate, High temperature PERMABOND® 920 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMAB..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Phenolic, set time
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength (d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties (discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage (discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	0.0833 - 0.333 min	0.00139 - 0.00556 hour	Plastic set time
Lord Adhesives 9010 Medium Viscosity, Odorless, Non-Frosting Methoxyethyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6160 BK Melt Processable Elastomer DuraGrip™ 6160BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6160BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6040 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6040 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6040 NC/BK have an excellent soft t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6060 NC Thermoplastic Elastomer (TPE) DuraGrip® DGR 6060NC is designed to be a general purpose Thermoplastic Elastomer (TPE) that is easy to use in injection molding and extrusion processes. DGR 6060NC has an excellent soft touch feel,..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6070 NC Thermoplastic Elastomer (TPE) DuraGrip® DGR 6070NC is designed to be a general purpose Thermoplastic Elastomer (TPE) that is easy to use in injection molding and extrusion processes. DGR 6070NC has an excellent soft touch feel,..
Cure Time	0.200 - 0.333 min	0.00333 - 0.00556 hour	per mm
Amity Thermosets ATR 126 Phenolic Molding Organic Filler, Injection Molded Characteristics:Ammonia freeGood mouldabilityGood mechanical strengthGood electrical insulationGood surface finishMedium thermal stability Color-black, brownSoft flow Applications:Telecommunication ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures (discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength (discontinued **) Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..