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Polymer Property : Cure Time = 3.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 93.3 °C,
Time 10800 sec
3.00 hour

@Temperature 200 °F,
Time 3.00 hour
Reltek BONDiT™ B-4682 Adhesive, Sealant & Coating System
Key Properties: Excellent adhesion to low surface energy plastics without primer or surface preparation.Applications: High flexibility, 300% elongation, emphasizing high tack for un-abraded substrat..
Cure Time 180 min

@Temperature 93.3 °C,
Time 10800 sec
3.00 hour

@Temperature 200 °F,
Time 3.00 hour
Reltek BONDiT™ B-4811 Adhesive, Sealant & Coating System
Key Properties: Semi-rigid, high strength.A filled version of B-481 to further increase chemical resistance and electrical properties and to lower shrinkage.Ease of use.Applications: Encapsulate sen..
Cure Time 180 - 240 min
3.00 - 4.00 hour
handling time
Permabond ET538 Epoxy Resin
PERMABOND ET538 is a structural, room temperature curing epoxy adhesive that has excellent adhesion to a wide variety of surfaces such as wood, metal, ceramics and many plastic and composite materia..
Cure Time 180 min
3.00 hour
Functional cure
ITW Devcon Flexane® Rubber Repair / Castable Urethane Fast Cure, Black
Information provided by ITW Devcon
Cure Time 180 - 240 min

@Temperature 149 °C
3.00 - 4.00 hour

@Temperature 300 °F
Master Bond EP45HT-1 Adhesive Resists Exposure to Sterilization
Description: Master Bond Polymer System EP45HT-1 is a remarkably fast curing, medium viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive ..
Cure Time 180 min
3.00 hour
2 hrs @ 125°C + 1 hr @ 140°C
Tra-Con Tra-Bond F202 Spectrally Transparent High Temperature Epoxy Adhesive
TRA-BOND F202 is a clear, low viscosity epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system..
Cure Time 180 min
3.00 hour
2 hrs @ 125°C + 1 hr @ 140°C
Tra-Con Tra-Bond F202HV Spectrally Transparent Thixotropic Epoxy Adhesive
TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system e..
Cure Time >= 180 min
>= 3.00 hour
Trelleborg Emerson & Cuming Stycast® E-1000 One-Component Epoxy Low Stress Encapsulant
Emerson & Cuming E-1000 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te..
Cure Time >= 180 min
>= 3.00 hour
Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant
Emerson & Cuming E-1030 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te..
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
Loctite® 3166 Deep Potting Epoxy
PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e..
Cure Time 180 min
3.00 hour
1 hr @ 25°C + 2 hrs @ 65°C
Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound
TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon..
Cure Time 180 min

@Temperature 25.0 °C
3.00 hour

@Temperature 77.0 °F
Full Cure; Steel
Loctite® 266 High Temperature/High Strength Threadlocker
ThreadlockersInvented by Loctite Corporation as a revolutionary method to lock and seal threaded fasteners, Loctite® Liquid Threadlockers have found wide acceptance in a range of applications--from..
Cure Time 180 - 1440 min

@Temperature 22.0 °C
3.00 - 24.0 hour

@Temperature 71.6 °F
Dow Corning SLYGARD® 3-6636 SILICONE DIELECTRIC GEL KIT
Two-part, transparent, LED encapsulant which is a lower-viscosity version of EG-6301.Information provided by Dow Corning
Cure Time >= 180 min

@Temperature 130 °C
>= 3.00 hour

@Temperature 266 °F
Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time >= 180 min

@Temperature 130 °C
>= 3.00 hour

@Temperature 266 °F
Cytec (Conap) RN-1000 / EA-117 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time 180 min
3.00 hour
Tack-Free Time
3M AC-350 Class A-1/2 Aerospace Sealant
3M Aerospace Sealant AC-350 Class A are fast-cure, intermediate density two-component, manganese dioxide cure, brushable, polysulfide fuel tank and fuselage sealants. 3M AC-350 Class A Sealants have..
Cure Time 180 min
3.00 hour
Hard Dry
3M Scotchkote™ 165CS Urethane Sealer
Scotchkote Urethane Sealer 165CS has been specifically developed as a low viscosity primer/sealer for concrete and cementitious surfaces prior to application of other Scotchkote urethane systems.Pro..
Cure Time 180 min
3.00 hour
Initial Set
3M Scotchkote™ FG 512 Epoxy Ceramic Surfacer
Scotchkote Epoxy Ceramic Surfacer FG 512 has been specifically developed as a ceramic enhanced epoxy repair coating for resurfacing and reforming metal machinery and equipment, such as pumps, impell..
Cure Time 180 - 240 min
3.00 - 4.00 hour
Touch Dry
3M Scotchkote™ UV 840 Urethane Coating
Scotchkote Urethane Coating UV 840 has been developed to provide a durable gloss finish for use as the final coat of 3M coating systems in the construction and transport industries, where an ease of..
Cure Time 180 min
3.00 hour
Initial Set
3M Scotchkote™ 60FG 534 Urethane Elastomer
Scotchkote Urethane Elastomer 60FG 534 has been specifically developed as an elastomeric system with a high degree of flexibility for resurfacing rubber components.Product Features:Physical properti..
Cure Time 180 - 360 min
3.00 - 6.00 hour
2-4 hr at 200°F followed by 1-2 hr at 350°F
Aremco Cerama-Dip™ 538-N-BLK High Temperature Specialty Ceramic-Inorganic Coating
Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available.
Cure Time 180 min
3.00 hour
Time to Handling Strength
3M Scotch-Weld™ DP270 Clear Structural Adhesive
Rigid potting compound, Non-corrosiveInformation provided by 3M
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