Processing Properties | Metric | English | Comments |
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Cure Time | 180 min @Temperature 93.3 °C, Time 10800 sec |
3.00 hour @Temperature 200 °F, Time 3.00 hour |
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Reltek BONDiT™ B-4682 Adhesive, Sealant & Coating System Key Properties: Excellent adhesion to low surface energy plastics without primer or surface preparation.Applications: High flexibility, 300% elongation, emphasizing high tack for un-abraded substrat.. |
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Cure Time | 180 min @Temperature 93.3 °C, Time 10800 sec |
3.00 hour @Temperature 200 °F, Time 3.00 hour |
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Reltek BONDiT™ B-4811 Adhesive, Sealant & Coating System Key Properties: Semi-rigid, high strength.A filled version of B-481 to further increase chemical resistance and electrical properties and to lower shrinkage.Ease of use.Applications: Encapsulate sen.. |
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Cure Time | 180 - 240 min | 3.00 - 4.00 hour | handling time |
Permabond ET538 Epoxy Resin PERMABOND ET538 is a structural, room temperature curing epoxy adhesive that has excellent adhesion to a wide variety of surfaces such as wood, metal, ceramics and many plastic and composite materia.. |
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Cure Time | 180 min | 3.00 hour | Functional cure |
ITW Devcon Flexane® Rubber Repair / Castable Urethane Fast Cure, Black Information provided by ITW Devcon |
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Cure Time | 180 - 240 min @Temperature 149 °C |
3.00 - 4.00 hour @Temperature 300 °F |
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Master Bond EP45HT-1 Adhesive Resists Exposure to Sterilization Description: Master Bond Polymer System EP45HT-1 is a remarkably fast curing, medium viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive .. |
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Cure Time | 180 min | 3.00 hour | 2 hrs @ 125°C + 1 hr @ 140°C |
Tra-Con Tra-Bond F202 Spectrally Transparent High Temperature Epoxy Adhesive TRA-BOND F202 is a clear, low viscosity epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system.. |
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Cure Time | 180 min | 3.00 hour | 2 hrs @ 125°C + 1 hr @ 140°C |
Tra-Con Tra-Bond F202HV Spectrally Transparent Thixotropic Epoxy Adhesive TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system e.. |
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Cure Time | >= 180 min | >= 3.00 hour | |
Trelleborg Emerson & Cuming Stycast® E-1000 One-Component Epoxy Low Stress Encapsulant Emerson & Cuming E-1000 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te.. |
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Cure Time | >= 180 min | >= 3.00 hour | |
Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant Emerson & Cuming E-1030 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te.. |
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Cure Time | 180 min @Temperature 80.0 °C |
3.00 hour @Temperature 176 °F |
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Loctite® 3166 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e.. |
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Cure Time | 180 min | 3.00 hour | 1 hr @ 25°C + 2 hrs @ 65°C |
Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon.. |
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Cure Time | 180 min @Temperature 25.0 °C |
3.00 hour @Temperature 77.0 °F |
Full Cure; Steel |
Loctite® 266 High Temperature/High Strength Threadlocker ThreadlockersInvented by Loctite Corporation as a revolutionary method to lock and seal threaded fasteners, Loctite® Liquid Threadlockers have found wide acceptance in a range of applications--from.. |
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Cure Time | 180 - 1440 min @Temperature 22.0 °C |
3.00 - 24.0 hour @Temperature 71.6 °F |
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Dow Corning SLYGARD® 3-6636 SILICONE DIELECTRIC GEL KIT Two-part, transparent, LED encapsulant which is a lower-viscosity version of EG-6301.Information provided by Dow Corning |
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Cure Time | >= 180 min @Temperature 130 °C |
>= 3.00 hour @Temperature 266 °F |
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Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | >= 180 min @Temperature 130 °C |
>= 3.00 hour @Temperature 266 °F |
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Cytec (Conap) RN-1000 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 180 min | 3.00 hour | Tack-Free Time |
3M AC-350 Class A-1/2 Aerospace Sealant 3M Aerospace Sealant AC-350 Class A are fast-cure, intermediate density two-component, manganese dioxide cure, brushable, polysulfide fuel tank and fuselage sealants. 3M AC-350 Class A Sealants have.. |
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Cure Time | 180 min | 3.00 hour | Hard Dry |
3M Scotchkote™ 165CS Urethane Sealer Scotchkote Urethane Sealer 165CS has been specifically developed as a low viscosity primer/sealer for concrete and cementitious surfaces prior to application of other Scotchkote urethane systems.Pro.. |
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Cure Time | 180 min | 3.00 hour | Initial Set |
3M Scotchkote™ FG 512 Epoxy Ceramic Surfacer Scotchkote Epoxy Ceramic Surfacer FG 512 has been specifically developed as a ceramic enhanced epoxy repair coating for resurfacing and reforming metal machinery and equipment, such as pumps, impell.. |
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Cure Time | 180 - 240 min | 3.00 - 4.00 hour | Touch Dry |
3M Scotchkote™ UV 840 Urethane Coating Scotchkote Urethane Coating UV 840 has been developed to provide a durable gloss finish for use as the final coat of 3M coating systems in the construction and transport industries, where an ease of.. |
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Cure Time | 180 min | 3.00 hour | Initial Set |
3M Scotchkote™ 60FG 534 Urethane Elastomer Scotchkote Urethane Elastomer 60FG 534 has been specifically developed as an elastomeric system with a high degree of flexibility for resurfacing rubber components.Product Features:Physical properti.. |
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Cure Time | 180 - 360 min | 3.00 - 6.00 hour | 2-4 hr at 200°F followed by 1-2 hr at 350°F |
Aremco Cerama-Dip™ 538-N-BLK High Temperature Specialty Ceramic-Inorganic Coating Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available. |
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Cure Time | 180 min | 3.00 hour | Time to Handling Strength |
3M Scotch-Weld™ DP270 Clear Structural Adhesive Rigid potting compound, Non-corrosiveInformation provided by 3M |