Polymer Property : Cure Time = 0.167 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Phenolic, handling time
Permabond 2011 Cyanoacrylate, gel PERMABOND® 2011 is a thixotropic, fast-setting cyanoacrylate particularly suitable for use on vertical and porous substrates. This material can be used on metals, plastics, elastomers, ceramics and..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Steel, handling time
Permabond 940 Cyanoacrylate, low odor PERMABOND 940 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6103 Adhesive Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6104 Adhesive Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6105 Adhesive Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6209 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6210 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP..
Cure Time	>= 0.167 min	>= 0.00278 hour	Fixture
Resinlab® CYNERGY CA6211 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP..
Cure Time	0.167 min	0.00278 hour	Buna N Rubber, handling time
Permabond 108 Cyanoacrylate, gap filling PERMABOND® 108 is an intermediate viscosity cyanoacrylate that is used to bond through intermediate gaps. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate adhes..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Phenolic, handling time
Permabond 920 Cyanoacrylate, High temperature PERMABOND® 920 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMAB..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	Phenolic, set time
Permabond 930 Cyanoacrylate PERMABOND 930 is a low odor, nonfogging, nonfrosting cyanoacrylate. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesives on hot and humid days, is eliminated. The ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Phenolic, set time
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed &nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	<= 0.167 min	<= 0.00278 hour
Dymax 928 Coil Terminating, Tamper proofing and Structural Electronic Bonder High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 928 Coil Terminating, Tamper proofing and Structural Electronic BonderHigh strength, excellent bridge bonding capabi..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6150 BK Melt Processable Elastomer DuraGrip™ 6150BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6150BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6160 BK Melt Processable Elastomer DuraGrip™ 6160BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6160BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6050 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6050 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6050 NC/BK have an excellent soft t..
Cure Time	0.167 - 0.667 min	0.00278 - 0.0111 hour	Time to Handling Strength
3M Scotch-Weld™ EC100 General Purpose Instant Adhesive 3M™ Scotch-Weld™ General Purpose Instant Adhesives are single component, high strength ethyl cyanoacrylate adhesive designed to bond to a variety of substances including most plastics, rubbers, me..
Cure Time	0.167 - 0.583 min	0.00278 - 0.00972 hour	Time to Handling Strength
3M Scotch-Weld™ FLX300 Flexible Instant Adhesive 3M™ Scotch-Weld™ Flexible Instant Adhesive FLX (formerly PR851) is formulated for extended resistance to impact, vibration, stress, peel, and humidity applications. It is faster curing than 3M™ S..
Cure Time	<= 0.167 min	<= 0.00278 hour	Phenolic, handling time
Permabond 910FS Cyanoacrylate, Methyl grade PERMABOND® 910FS is the original 100%-methyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive (di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Cure Time	0.167 - 0.250 min	0.00278 - 0.00417 hour	PVC, handling time
Permabond 947 Cyanoacrylate, low odor PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time	0.167 min	0.00278 hour	at 75 mW/cm^2
Loctite® Nuva-Sil® 5084 Sealant Silicon Light Cure Adhesives and Gasketing and Wire TackersLoctite® innovative gasketing products offer precise, reliable sealing of electronic enclosures, protecting them from environmental hazard..