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Polymer Property : Cure Time = 0.0500 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 1.00 - 3.00 min

@Temperature 180 °C
0.0167 - 0.0500 hour

@Temperature 356 °F
Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive
LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po..
Cure Time 1.80 - 3.00 min

@Temperature 149 °C
0.0300 - 0.0500 hour

@Temperature 300 °F
Master Bond EP17HT-3 One component, snap-curing epoxy system
Product Description: Master Bond Polymer System EP17HT-3 is a one part epoxy that fully cures in 2-3 minutes at 250-300°F. It is capable of service up to +400°F with excellent strength retention p..
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