Processing Properties | Metric | English | Comments |
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Cure Time | 1.00 - 3.00 min @Temperature 180 °C |
0.0167 - 0.0500 hour @Temperature 356 °F |
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Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po.. |
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Cure Time | 1.80 - 3.00 min @Temperature 149 °C |
0.0300 - 0.0500 hour @Temperature 300 °F |
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Master Bond EP17HT-3 One component, snap-curing epoxy system Product Description: Master Bond Polymer System EP17HT-3 is a one part epoxy that fully cures in 2-3 minutes at 250-300°F. It is capable of service up to +400°F with excellent strength retention p.. |