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Polymer Property : Cure Time = 2.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 min @Temperature 24.0 °C |
2.00 hour @Temperature 75.2 °F |
and 45 minutes at 65.5°C, followed by 45 minutes at 98.8° C (recommended) |
| Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating .. |
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| Cure Time | 120 min @Temperature 177 °C |
2.00 hour @Temperature 351 °F |
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| Henkel SynSpand 9840 Expanding Syntactic Film Expanding modified epoxy film, cures at 300°F / 149°C, used for jet engine abradable fan seals. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
Overnight at 75°F followed by |
| Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat.. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
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| Master Bond EP21TDC Toughened, Shock Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving.. |
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| Cure Time | 120 - 180 min @Temperature 65.6 °C |
2.00 - 3.00 hour @Temperature 150 °F |
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| Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Cure Time | 120 - 180 min @Temperature 121 - 149 °C |
2.00 - 3.00 hour @Temperature 250 - 300 °F |
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| Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°.. |
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| Cure Time | 120 - 180 min @Temperature 65.6 °C |
2.00 - 3.00 hour @Temperature 150 °F |
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| Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical an.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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| Trelleborg Emerson & Cuming Eccobond® 15 Variable Hardness Catalyst Emerson & Cuming 15 Eccobond® Variable Hardness CatalystEasy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields cured .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo.. |
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| Cure Time | 120 min @Temperature 25.0 °C |
2.00 hour @Temperature 77.0 °F |
Tack Free |
| Chesterton MRS S2 Metal Rebuilding System An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% solids. MRS S2 is.. |
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| Cure Time | 120 min @Temperature 60.0 °C |
2.00 hour @Temperature 140 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 55579R043W 0.043" (1.09 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-410R Bulk Compound Design/Construction: Bulk Compound (packaged in polyethylene) This data Represents typical values for the production material. The data should not be used to write, or in place of, material specific.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-434R Bulk Compound Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-475R Bulk Compound Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon R35948R015 0.0155" (0.394 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Interleave: Polyethylene Side 1, Layer 2: Uncured Silicone RubberSide 1, Layer 1: Cured Silicone Rubber Substrate: Style 7628 Fiberglass Side 2: Cured Silicone RubberThis data re.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 51344R015 0.015" (0.381 mm) Semi-Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Semi-Cured Silicone RubberAppearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. The data should not be used to .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
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| Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat.. |
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| Cure Time | 120 min @Temperature 4.40 °C |
2.00 hour @Temperature 39.9 °F |
Tack-Free Time |
| 3M AC-250 B-1/6 Aerospace Sealant 3M Aerospace Sealant AC-250 B-1/6 is a two-part, polysulfide, quick repair sealant for integral fuel tank and fuselage sealing applications. The mixed compound is a thixotropic paste and can be read.. |
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| Cure Time | 120 min @Temperature 232 °C |
2.00 hour @Temperature 450 °F |
Recommended Post Cure Cycle |
| Arlon 48576R006 0.0055" Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Interleave: 0.0015" PolyethyleneSide 1: Uncured RubberSubstrate: Prime Coated 1080 FiberglassSide 2: Uncured RubberThis data represents typical values for the production mater.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
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| Resinlab® EP1238 Black Acrylic / Epoxy Hybrid Adhesive Resinlab™ EP1238 Black is a two part acrylic / epoxy hybrid adhesive designed for bonding metals and plastics. It cures quickly at room temperature to a tough, semi-rigid material. It has good wett.. |
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