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Polymer Property : Cure Time = 1.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
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| Resin Technology Group 160-EX Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond F202 Anaerobic Retainer The unique 'toughening' process incorporated into Permabond® F202 gives this anaerobic adhesive excellent resistance to peel and impact forces. Primarily designed for use on metal surfaces, it is a.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Aluminum, handling strength |
| Permabond HH131 High Temperature Threadlocker Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for .. |
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| Cure Time | 60.0 min @Temperature 95.0 °C |
1.00 hour @Temperature 203 °F |
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| Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
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| Gwent Electronic Materials C2041206P2 Gold Polymer Electrode Paste Gold paste is a screen printable gold polymer paste designed as a working electrode in electrochemical biosensors. This is used as a working electrode in medical diagnostics, environmental sensor a.. |
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| Cure Time | 60.0 min @Temperature 177 °C |
1.00 hour @Temperature 351 °F |
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| Henkel Hysol MA 557 Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2000-40A/B Elastomer KEG2000-40 is a fast cure type liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl.. |
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| Cure Time | 60.0 - 120 min @Temperature >=79.4 °C |
1.00 - 2.00 hour @Temperature >=175 °F |
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| Master Bond MB600G Aqueous Based Electrically Conductive Sodium Silicate Coating Master Bond MB600G is an aqueous based, sodium silicate system with graphite filler. It is intended for use in applications where moderate shielding effectiveness is required and cost is a more sign.. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
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| Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Bond 716K02 Thixotropic Adhesive 716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond F113SC BLK High Tg Fiber Optic Epoxy Adhesive TRA-BOND F113SC BLK is a fiber optic adhesive used for terminating ALL types of fiber optic connectors as well as LED displays, lenses and other optical components. It produces a typical Tg of 95°C.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c.. |
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| Cure Time | 60.0 min @Temperature 90.0 °C |
1.00 hour @Temperature 194 °F |
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| Tra-Con Tra-Cast 9182A Semi-Rigid Flame Retardant Epoxy Encapsulant TRA-CAST 9182A is a medium viscosity, flame retardant epoxy encapsulant. It adheres well to most electronic and aerospace-industry materials like metals, glass, ceramic, industrial laminates and rig.. |
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| Cure Time | 60.0 - 240 min @Temperature 150 °C |
1.00 - 4.00 hour @Temperature 302 °F |
|
| Trelleborg Emerson & Cuming Eccobond® B 97 Heat Cure Catalyst Emerson & Cuming B 97 Eccobond® Heat Cure CatalystVery high temperature resistance, not as brittle as 17 M 1. Cures from 80°C to 200°C. Excellent chemical resistance. May also be used as an accel.. |
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| Cure Time | 60.0 min @Temperature 16.0 °C |
1.00 hour @Temperature 60.8 °F |
Full Load |
| Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc.. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
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| Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional .. |
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| Cure Time | 60.0 min @Temperature 40.0 °C |
1.00 hour @Temperature 104 °F |
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| Epoxyset Epoxiohm EO-30FST Electrically Conductive Epoxy Adhesive EO-30-FST is two part, fast cure, silver filled, and high electrical conductivity epoxy adhesive. Both components are silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy .. |
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| Cure Time | 60.0 min @Temperature 16.0 °C |
1.00 hour @Temperature 60.8 °F |
Full Load |
| Chesterton MRS 5 Metal Rebuilding System MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we.. |
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| Cure Time | 60.0 - 120 min @Temperature 82.222 - 98.889 °C |
1.00 - 2.00 hour @Temperature 180.00 - 210.00 °F |
|
| Abatron AboTar 8607-1 Solventless Tar-Epoxy Compound AboTar 8607-1 is a 2-part tar-epoxy lower cost system for filling and leveling pot holes and grossly uneven flooring. It can be used neat or with sand or aggregates. Uses: Resurfacing concrete and .. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8504-1 One-Component Epoxy AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications. |
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| Cure Time | 60.0 min @Temperature 24.0 °C |
1.00 hour @Temperature 75.2 °F |
|
| Parker Chomerics CHO-SHIELD® 1091 PRIMER CHO-SHIELD 1091 is an air-drying liquid coating for enhancing the adhesion of CHO-SHIELD 2001 and 2003 corrosion resistant, electrically conductive coatings to chemically treated aluminum. CHO-SHIEL.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Zinc, working strength |
| Permabond HM135 Anaerobic Retainer Permabond® HM135 is a fast curing, medium viscosity anaerobic adhesive for locking and sealing threads and retaining cylindrical components. It gives maximum torque strength on brass or plated bras.. |
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| Cure Time | 60.0 min @Temperature 85.0 °C |
1.00 hour @Temperature 185 °F |
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| Resinlab® UR3001 Clear Two Part Urethane Encapsulant Resinlab™ UR 3001 is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR 3001 provides excellent environmental p.. |
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| Cure Time | 60.0 min @Temperature 82.0 °C |
1.00 hour @Temperature 180 °F |
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| Henkel Hysol EA 9320NA Paste Adhesive System High shear and high peel adhesive system with room temperature cure. |
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| Cure Time | 60.0 min @Temperature 177 °C |
1.00 hour @Temperature 351 °F |
|
| Henkel Hysol MA 560 Core Splice Adhesive A modified epoxy, low density (24-25 psf) foaming film adhesive capable of expanding 2.5 times the original thickness. Cures at 250°F / 121°C or 350°F / 177°C and is designed for service at temp.. |
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