Polymer Property : Cure Time = 0.333 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	20.0 min @Temperature 177 °C	0.333 hour @Temperature 351 °F
Resinlab® EP950NMF Gray Non-Metallic Filled Rubber Modified Epoxy Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated tem..
Cure Time	20.0 min @Temperature 25.0 Â°C	0.333 hour @Temperature 77.0 Â°F	Tack-free, 50% R.H.
Momentive Performance Materials N-SilÂ® RTV122 Silicone Modified Alkoxy Adhesive Sealants, White N-SilÂ® adhesive sealants are one-component, ready-to-use, and cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature.Key Performance Properties: Primer..
Cure Time	20.0 min @Temperature 120 °C	0.333 hour @Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® D 778 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 778 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, semi-flexible, thixotropic, fast heat curing, epoxy structural adhesive. Good peel strength (20 pli). Recommend..
Cure Time	20.0 min @Temperature 150 °C	0.333 hour @Temperature 302 °F
Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation..
Cure Time	20.0 min @Temperature 160 °C	0.333 hour @Temperature 320 °F
Trelleborg Emerson & Cuming Eccobond® 2780-45 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming 2780-45 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveFilled, pourable, high temperature resistant, epoxy adhesive. Long term resistance to boiling glycol. Exc..
Cure Time	20.0 min @Temperature 160 °C	0.333 hour @Temperature 320 °F
Trelleborg Emerson & Cuming Eccobond® 930-09 Low Temperature Performance Lighting Epoxy Adhesive Emerson & Cuming 930-09 Eccobond® Low Temperature Performance Lighting Epoxy AdhesiveFlexible, non-blushing, epoxy adhesive for glass headlamp bonding. Maintains flexibility at temperatures as low ..
Cure Time	20.0 min @Temperature 120 °C	0.333 hour @Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® D 275 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 275 Eccobond® One-Component Fast Cure Epoxy AdhesiveSemi-rigid, high strength, fast curing, pourable, epoxy structural adhesive. Good peel strength (12 pli), Recommended for bond..
Cure Time	20.0 min @Temperature 160 °C	0.333 hour @Temperature 320 °F
Trelleborg Emerson & Cuming Eccobond® G757 One-Component High Strength-Impact Resistant Epoxy Adhesive Emerson & Cuming G757 Eccobond® One-Component High Strength-Impact Resistant Epoxy AdhesiveVery flexible, thixotropic, epoxy adhesive. Excellent low temperature resistance. Excellent adhesion to gl..
Cure Time	20.0 min @Temperature 175 °C	0.333 hour @Temperature 347 °F
Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic..
Cure Time	20.0 min @Temperature 25.0 °C	0.333 hour @Temperature 77.0 °F	tack free
Cytec CC-1191 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	20.0 min @Temperature 25.0 °C	0.333 hour @Temperature 77.0 °F	tack free
Cytec CE-1171 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	20.0 - 30.0 min @Temperature 25.0 °C	0.333 - 0.500 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1194 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	20.0 - 30.0 min @Temperature 25.0 °C	0.333 - 0.500 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CE-1164 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	20.0 min @Temperature 120 °C	0.333 hour @Temperature 248 °F
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology
Cure Time	20.0 min @Temperature 100 °C	0.333 hour @Temperature 212 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Cure Time	20.0 min @Temperature 100 °C	0.333 hour @Temperature 212 °F	minimum
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Cure Time	20.0 min @Temperature 80.0 °C	0.333 hour @Temperature 176 °F	minimum
Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope..
Cure Time	20.0 min @Temperature 149 °C	0.333 hour @Temperature 300 °F
3M Scotchcast™ 260 8 G Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..
Cure Time	20.0 min @Temperature 180 °C	0.333 hour @Temperature 356 °F
Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em..
Cure Time	20.0 min @Temperature 177 °C	0.333 hour @Temperature 351 °F
3M Scotchcast™ 265 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t..
Cure Time	20.0 min @Temperature 177 °C	0.333 hour @Temperature 351 °F
3M Scotchkote™ 412 Spray Grade Fusion Bonded Epoxy Coating 3M Scotchkote Spray Grade Fusion Bonded Epoxy Coating 413 is a one-part, heat curable, thermosetting epoxy coating designed for corrosion protection of reinforcing steel. The epoxy is applied to pre..
Cure Time	20.0 min @Temperature 24.0 °C	0.333 hour @Temperature 75.2 °F	Followed by 20 min 60°-75°C
Parker Chomerics CHO-SHIELD® 2052 Conductive Coating CHO-SHIELD® 2052 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used fo..