Polymer Property : Cure Time = 0.0833 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
NextGen Adhesives P907-01 Fiber Optic Adhesive Description: NGAC P907-01 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
NextGen Adhesives P907-12 Fiber Optic Adhesive Description: NGAC P907-12 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1330 Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F
Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-30A/B Elastomer KE-1950-30 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2001-40A/B Elastomer KEG2001-40 is a very fast cure type liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enou..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-50A/B Elastomer KE-1950-50 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond 526M04 Color Keyed High Temperature Epoxy Adhesive TRA-BOND 526M04 is a low viscosity, high-temperature, two-part epoxy formulation with a long working life. TRA-BOND 526M04 exhibits excellent wicking, and develops strong, tough mechanically stable ..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Cure Time	5.00 - 30.0 min @Temperature 149 °C	0.0833 - 0.500 hour @Temperature 300 °F
Master Bond Supreme 10HTFS Silver Conductive Microelectronic Epoxy Description: Master Bond Polymer System Supreme 10HTFS “snap cure” epoxy is a formulated system featuring a combination of high performance properties including high shear and peel strength, outst..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	minimum
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing..
Cure Time	5.00 min @Temperature 200 °C	0.0833 hour @Temperature 392 °F
ACC QLE 1100 QSI Quantum Silicones 43 Durometer Clear, Addition Cure, 1-part Elastomer for Coating QLE 1100 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
Cure Time	5.00 min @Temperature 204 °C	0.0833 hour @Temperature 399 °F
3M Scotchcast™ 265 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t..
Cure Time	5.00 min @Temperature 155 °C	0.0833 hour @Temperature 311 °F	TC90
TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 2.0 PHR MBTS Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m..
Cure Time	5.00 min @Temperature 95.0 °C	0.0833 hour @Temperature 203 °F
Tra-Con Tra-Bond 224-8 Room Temperature Cure Epoxy Adhesive TRA-BOND 224-8 room temperature cure epoxy adhesive is a thermally conductive version of 224-1. This adhesive develops structural strength rapidly. When cured at room temperature, this adhesive prov..
Cure Time	5.00 - 10.000 min @Temperature 149 °C	0.0833 - 0.16667 hour @Temperature 300 °F
Master Bond Supreme 3AN One Component, Heat Curing Epoxy Adhesive Description: Master Bond Polymer System SUPREME 3AN is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with excellent thermal conductivity and co..