Processing Properties | Metric | English | Comments |
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Cure Time | 30.0 - 60.0 min @Temperature 120 °C |
0.500 - 1.00 hour @Temperature 248 °F |
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Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Cure Time | 40.2 - 60.0 min @Temperature 43.3 °C |
0.670 - 1.00 hour @Temperature 110 °F |
De-mold Time |
Northstar Polymers MPP-R02C Semi-rigid Polyurethane Foam Formulation MPP-R02C is semi-rigid foam formulations for molded foam products. It is closed-cell light foam with some structural integrity. Unlike rigid polyurethane foams, the physical properties of a cured pr.. |
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Cure Time | 30.0 - 60.0 min @Temperature 23.0 °C |
0.500 - 1.00 hour @Temperature 73.4 °F |
brass, fixture time |
Permabond LH056 Anaerobic Threadsealant Permabond LH056 is a thread sealant designed for use in sealing metal pipes and fittings in sprinkler systems which may also contain CPVC piping. Permabond LH056 prevents leaks even on pipes that ar.. |
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Cure Time | 30.0 - 60.0 min @Temperature 125 °C |
0.500 - 1.00 hour @Temperature 257 °F |
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Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv.. |
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Cure Time | 30.0 - 60.0 min @Temperature 93.3 °C |
0.500 - 1.00 hour @Temperature 200 °F |
1 hour at 250°F and 2-3 hours at 300°F, plus a post cure of 1-2 hours at 350°F |
Master Bond EP45HTND-2 Chemically Resistant, Non-Drip Epoxy Description: Master Bond EP45HTND-2 is a two component epoxy system for high performance bonding, sealing and coating. It is used for applications requiring solid temperature resistance and capable .. |
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Cure Time | 1.20 - 60.0 min @Temperature 22.0 °C |
0.0200 - 1.00 hour @Temperature 71.6 °F |
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Dow Corning 3-4222 DIELECTRIC FIRM GEL KIT Two-part, translucent green, firm, fast RT or heat cure, and primerless chemical adhesion.Information provided by Dow Corning |
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Cure Time | 30.0 - 60.0 min @Temperature 80.0 - 120 °C |
0.500 - 1.00 hour @Temperature 176 - 248 °F |
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Abatron AboCast 8005-6/AboCure 8005-6 Epoxy AboCast 8005-6 is a tan, viscous filled liquid resin with a weight of approximately 11 lbs/gallon. AboCure 8005-6 is an amber, viscous liquid converter with a weight of approximately 10 lbs/gallon. .. |
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Cure Time | 45.0 - 60.0 min @Temperature 100 °C |
0.750 - 1.00 hour @Temperature 212 °F |
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ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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Cure Time | 20.0 - 60.0 min @Temperature 24.0 °C |
0.333 - 1.00 hour @Temperature 75.2 °F |
demold time |
BCC Products Proto-Kast BC 8163 Urethane Casting BC 8163 is a very low viscosity, rapid setting, rigid urethane compound. This system will cure quickly to a hard, tough, impact resistant casting. BC 8163 is non-sensitive to moisture after cure and.. |
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Cure Time | 45.0 - 60.0 min @Temperature 149 °C |
0.750 - 1.00 hour @Temperature 300 °F |
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Master Bond Supreme 10HTFL One Part Epoxy Cures at 250°F Description: Master Bond Polymer System Supreme 10HTFL features a blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4.. |