Polymer Property : Cure Time = 5.00 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
NextGen Adhesives P907-01 Fiber Optic Adhesive Description: NGAC P907-01 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
NextGen Adhesives P907-13 Fiber Optic Adhesive Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
Resinlab® SEC1244 Silver Filled Epoxy Adhesive Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth..
Cure Time	5.00 - 10.0 min @Temperature 120 Â°C	0.0833 - 0.167 hour @Temperature 248 Â°F
Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE2001-40A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Cure Time	5.00 min @Temperature 85.0 °C	0.0833 hour @Temperature 185 °F
Loctite® 3180 Deep Potting Polyurethane PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For ..
Cure Time	5.00 min @Temperature 160 °C	0.0833 hour @Temperature 320 °F
Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F	minimum
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
Atom Adhesives AA-BOND F123BK Epoxy Adhesive AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or mul..
Cure Time	5.00 min @Temperature 482 °C	0.0833 hour @Temperature 900 °F	Step 2
Aremco Ceramacoat™ 845-BLU High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, blue coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, stadiu..
Cure Time	5.00 min @Temperature 155 °C	0.0833 hour @Temperature 311 °F	TC90
TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 2.0 PHR MBTS Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m..