Polymer Property : Cure Time = 180 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	180 - 360 min @Temperature 25.0 °C	3.00 - 6.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MPC-W44A Polyurethane Gel MPC-W44A is a polyurethane gel formulation specifically designed for padding and cushioning application that requires Shore Durometer OOO scale hardness. Produces good rebound characteristics and g..
Cure Time	180 - 360 min @Temperature 23.0 °C	3.00 - 6.00 hour @Temperature 73.4 °F	M10 steel, working strength
Permabond HH131 High Temperature Threadlocker Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for ..
Cure Time	180 - 360 min @Temperature 23.0 °C	3.00 - 6.00 hour @Temperature 73.4 °F	M10 steel, working strength
Permabond HH167 Anaerobic Retainer Permabond® HH167 is a high viscosity gap filling silver paste, which can be used for repairing metal machinery parts. It is ideal for repairing worn shafts, broken threads, damaged keyways and spli..
Cure Time	180 - 360 min @Temperature 23.0 °C	3.00 - 6.00 hour @Temperature 73.4 °F	Zinc, working strength
Permabond HH190 Anaerobic Gasketmaker Permabond® HH190 Gasketmaker is an anaerobic curing flange sealant that can replace, or be used as a dressing for, conventional pre-cut gaskets. Since HH190 is a flowable paste, it conforms to the ..
Cure Time	180 min @Temperature 23.0 °C	3.00 hour @Temperature 73.4 °F	Zinc, working strength
Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper..
Cure Time	180 - 240 min @Temperature 25.0 °C	3.00 - 4.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MPP-A65A High Performance Polyether This high performance polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this system ex..
Cure Time	180 - 240 min @Temperature 93.3 °C	3.00 - 4.00 hour @Temperature 200 °F
Master Bond EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDC-4ND is a two component, very flexible epoxy system for high performance bonding, sealing and coating with a non-drip consistency. It has a one to four mix ra..
Cure Time	180 - 240 min @Temperature 121 - 149 °C	3.00 - 4.00 hour @Temperature 250 - 300 °F
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Cure Time	180 min @Temperature 75.0 °C	3.00 hour @Temperature 167 °F
Tra-Con Tra-Bond 724-20 Polyurethane Adhesive TRA-BOND 724-20 polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates including aluminum, solder, nylon, mylar and steel. TRA-BOND 72..
Cure Time	180 min @Temperature 70.0 °C	3.00 hour @Temperature 158 °F
Tra-Con Tra-Bond 9349K Room Temperature Cure Flexible Epoxy Adhesive TRA-BOND 9349K epoxy adhesive is a flexible, two part, room temperature curing system with high peel and sheer strengths. TRA-BOND 9349K is excellent for bonding many metals and woods, most plastics..
Cure Time	180 min @Temperature 70.0 °C	3.00 hour @Temperature 158 °F
Tra-Con Tra-Bond 9349M Room Temperature Cure Flexible Epoxy Adhesive TRA-BOND 9349M epoxy adhesive is a flexible, two part, room temperature curing system with high peel and sheer strengths. TRA-BOND 9349M is excellent for bonding many metals and woods, most plastics..
Cure Time	180 min @Temperature 100 °C	3.00 hour @Temperature 212 °F
Tra-Con Tra-Bond F211 General Purpose Fiber Optic Epoxy Adhesive TRA-BOND F211 is a general purpose fiber optic epoxy adhesive recommended for bonding and small volume potting applications where superior wetting and physical properties are needed at both high and..
Cure Time	180 min @Temperature 65.0 °C	3.00 hour @Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conduc..
Cure Time	180 min @Temperature 32.0 °C	3.00 hour @Temperature 89.6 °F	Tack Free
Chesterton ARC HT-T Spark Testable High Temperature Trowelable Abrasion Control Compound An advanced ceramic composite formulated to protect equipment from corrosion and erosion in elevated temperature water solution immersion. This system is a high viscosity composite that is applied b..
Cure Time	180 min @Temperature 32.0 °C	3.00 hour @Temperature 89.6 °F	Overcoat Begin
Chesterton ARC HT-T Spark Testable High Temperature Trowelable Abrasion Control Compound An advanced ceramic composite formulated to protect equipment from corrosion and erosion in elevated temperature water solution immersion. This system is a high viscosity composite that is applied b..
Cure Time	180 min @Temperature 29.0 °C	3.00 hour @Temperature 84.2 °F	Overcoat End
Chesterton ARC S7 High Temperature & Chemical Resistant Novolac Vinyl Ester Coating Description: ARC S7 is a low VOC, epoxy novolac vinyl ester based coating intended for high temperature exposures in chemically aggressive applications where the risk for thermal cycling may be pres..
Cure Time	180 min @Temperature 16.0 °C	3.00 hour @Temperature 60.8 °F	Tack Free
Chesterton MRS S2 Metal Rebuilding System An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% solids. MRS S2 is..
Cure Time	180 min @Temperature 60.0 °C	3.00 hour @Temperature 140 °F
Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	180 min @Temperature 60.0 °C	3.00 hour @Temperature 140 °F
Cytec Conathane® CE-1175 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli..
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F	minimum
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. ..
Cure Time	180 min @Temperature 65.0 °C	3.00 hour @Temperature 149 °F
Epoxyset Epoxibond EB-106 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Cure Time	180 min @Temperature 65.0 °C	3.00 hour @Temperature 149 °F
Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Cure Time	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
Cure Time	180 min @Temperature 16.0 °C	3.00 hour @Temperature 60.8 °F	Tack Free
Chesterton ARC MXC Castable Extreme Wear Compound Description: An advanced ceramic composite, with flowable viscosity, for the repair and protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack. It can be hand tro..
Cure Time	180 min @Temperature 16.0 °C	3.00 hour @Temperature 60.8 °F	Full Chemical
Chesterton MRS 5 Metal Rebuilding System MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we..