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- Polymer Property : Cure Time = 120 min
Polymer Property : Cure Time = 120 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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| NextGen Adhesives P907-26 Optical Assembly Adhesive Description: NGAC P907-26 is a low viscosity and room temperature curing adhesive specifically formulated for optical applications where clarity is critical.Advantages and Applications: Uses include.. |
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| Cure Time | 120 - 180 min @Temperature 25.0 °C |
2.00 - 3.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers MPP-A90A High Performance Polyether This high performance polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this system ex.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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| NextGen Adhesives EC907-34 Epoxy Adhesive Description: NGAC EC907-34 is a two part, electrically conductive silver filled epoxy adhesive which can be cured at room temperature. It was designed for applications requiring excellent mechanical.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
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| Resin Technology Group TIGA 291-EX Grey Medium Viscosity Polyamide Epoxy Adhesive Mix ratio 1 to 1 by weight.Tiga 291 EX Grey is a medium viscosity polyamide/ epoxy adhesive recommended for bonding applications where high shock impact resistance and peel resistance are desired. T.. |
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| Cure Time | 120 - 240 min @Temperature 25.0 °C |
2.00 - 4.00 hour @Temperature 77.0 °F |
1 dry mil; tack free |
| Lord Adhesives Aeroglaze® 9929 Epoxy Primer Aeroglaze® 9929 epoxy primer is designed to be used on properly prepared aluminum and steel surfaces for applications that require protection against corrosion.All information provided by Lord. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21NDFG Two component epoxy compound for high performance applications Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency.. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one .. |
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| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| Master Bond EP30AN-1 Low Viscosity, NASA Low Outgassing Epoxy Description: Master Bond EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring high thermal conductivity, excellent electrical insulation properties and N.. |
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| Cure Time | 120 min @Temperature 95.0 °C |
2.00 hour @Temperature 203 °F |
|
| Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a.. |
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| Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond 968-5 High Dielectric Constant Epoxy Adhesive TRA-BOND 968-5 is a high dielectric constant epoxy adhesive. This one component, electrically insulating epoxy adhesive is designed for chip bonding.Information provided by Tra-Con Inc. |
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| Cure Time | 120 min @Temperature 21.0 °C |
2.00 hour @Temperature 69.8 °F |
Full Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 120 min @Temperature 25.0 °C |
2.00 hour @Temperature 77.0 °F |
Tack Free |
| Chesterton ARC S2 Ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% soli.. |
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| Cure Time | 120 min @Temperature 100 °C |
2.00 hour @Temperature 212 °F |
|
| Cytec EN-2532 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| Cure Time | 120 min @Temperature 125 °C |
2.00 hour @Temperature 257 °F |
|
| Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f.. |
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| Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
| Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and.. |
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| Cure Time | 120 - 240 min @Temperature 120 - 160 °C |
2.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-27 High-Performance Dielectric Epoxy AboCast 8103-27 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 30300R062 0.062" (1.57 mm) Uncured Silicone Rubber on Kodacel Carrier Design/Construction: Interleave: Polyethylene Side 1: Uncured Silicone RubberCarrier: KodacelAppearance: Red silicone gum on polymer linersThis data represents typical values for the production mate.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Post Cure Cycle |
| Arlon 30570R015 0.015" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 55579R028M 0.029" (0.737 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-322 Bulk Compound Product Use: Silicone rubber (bulk compound)Appearance: Red silicone rubber.This data represents typical values for the production material. The data should not be used to write, or in place of, mat.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon CP-494 Bulk Compound This data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arlon, Silicone Technologies Di.. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
Alternate Cure |
| Aremco Aremco-Bond™ 2210 High Performance Epoxide Aluminum and Ceramic-Filled, Vibration and Impact Resistant, for Repairing Aluminum Mold and Wear Surfaces. |
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| Cure Time | 120 min @Temperature 93.3 °C |
2.00 hour @Temperature 200 °F |
Step 1, preceeded by 1-4 hour air set |
| Aremco Ceramabond™ 600-N High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled Aremco Ceramabond™ 600-N High Temperature Ceramic Adhesive/Paste, Alumino-Silica Filled |
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| Cure Time | 120 - 240 min @Temperature 120 - 160 °C |
2.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-29 High-Performance Dielectric Epoxy AboCast 8103-29 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h.. |
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| Cure Time | 120 min @Temperature 204 °C |
2.00 hour @Temperature 400 °F |
Recommended Postcure Cycle |
| Arlon 47091R012 0.012" (0.305 mm) Uncured Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured RubberSide 2: Uncured RubberAppearance: Red silicone gum on polymer linerThis data represents typical values for the production material. The data should not be u.. |
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| Cure Time | 120 min @Temperature 260 °C |
2.00 hour @Temperature 500 °F |
Step 3 |
| Aremco Ceramabond™ 865 High Temperature Ceramic Adhesive/Paste, Aluminum Nitride Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and.. |
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