Processing Properties | Metric | English | Comments |
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Pot Life | 8.00 - 12.0 min @Temperature 25.0 °C |
8.00 - 12.0 min @Temperature 77.0 °F |
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Resin Technology Group TIGA 108 Room Temperature Curing Epoxy Adhesive 1 to1 mix ratio by volume.TIGA 108 is an epoxy adhesive system that provides excellent bond strength to most substrates. Recommended for production bonding applications, this low viscosity formulati.. |
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Pot Life | 10.0 - 12.0 min @Temperature 25.0 °C |
10.0 - 12.0 min @Temperature 77.0 °F |
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Permabond ET5401 Epoxy Resin PERMABOND® ET5401 is a two-part, 2:1 mixable, semi-flexible toughened no slump epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo.. |
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Pot Life | 11.0 - 12.0 min | 11.0 - 12.0 min | |
Northstar Polymers SAI-1 Low Viscosity Variable Ratio Polyurethane Gel SAI-1 is custom formulated polyurethane gel material to yield very soft elastomer gel material from low viscosity components at room temperature. This material is variable mixing ratio so that the .. |
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Pot Life | 7.00 - 12.0 min @Temperature 23.9 °C |
7.00 - 12.0 min @Temperature 75.0 °F |
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Devcon Combo Wear FC Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives. |