Processing Properties | Metric | English | Comments |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11.. |
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Pot Life | 8.0 min @Temperature 21.1 °C |
8.0 min @Temperature 70.0 °F |
Working Time |
Protective Coating PC-Fahrenheit™ High Temperature Epoxy PC-Fahrenheit™ is a hand moldable putty epoxy designed for quick emergency-type repairs formulated for increased temperatures. PC-Fahrenheit™ can be expected to outperform other putties at high te.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | |
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | |
Resin Technology Group 2TN Oxy-Bond™ Two-Component Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Time before parts must be mated |
Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive Lord Adhesives 648 Low Odor, Low Flammability, Non Sag, Metal Use Acrylic Adhesive |
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Pot Life | 8.0 - 15 min | 8.0 - 15 min | Time before parts must be mated |
Lord Adhesives 7542C Two-Component Urethane Adhesive Lord Urethane AdhesivesLord® one- and two-part urethane adhesives provide superior bonds with minimal surface preparation for today's high performance thermosets and thermoplastics. They offe.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | |
ITW Plexus Plexusâ„¢ MA320 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Excellent low temperature and toughness properties.Information provided by Illinois Tool Works. |
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Pot Life | 8.0 - 10 min @Temperature 24.0 °C |
8.0 - 10 min @Temperature 75.2 °F |
1 lb. mass |
BCC Products BC 8165 Urethane Casting BC 8165 is a low viscosity, rapid setting, rigid urethane compound. This system will cure quickly to a hard, tough, impact resistant casting. BC 8165 is non-sensitive to moisture after cure and wil.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP1199 Black Unfilled Epoxy Adhesive Resinlab™ EP1199 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP1115 Clear Unfilled Epoxy Adhesive Resinlab™ EP1115 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |
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Pot Life | 8.0 - 12 min | 8.0 - 12 min | Mass: 50g; TM R050-19 |
Resinlab® EP1199 Clear Unfilled Epoxy Adhesive Resinlab™ EP1199 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |