Processing Properties | Metric | English | Comments |
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Pot Life | 7200 min | 7200 min | (5 days) |
Tra-Con Tra-Bond 2208 Water White High Temperature Epoxy Adhesive TRA-BOND 2208 is a clear, almost water-white low viscosity epoxy adhesive system recommended for rigid laminating, filament winding, potting and bonding applications. This all-liquid formulation con.. |
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Pot Life | 7200 min | 7200 min | (5 days) |
Tra-Con Tra-Bond 546S04 Thixotropic UV/Blue Light Cure Adhesive TRA-BOND 546S04 is a thixotropic UV/blue light curable adhesive with a secondary heat cure. TRA-BOND 546S04 is ideal for general optics bonding, mounting of lenses, and glob top applications. The .. |
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Pot Life | 7200 min | 7200 min | (5 days) |
Tra-Con Tra-Bond F202 Spectrally Transparent High Temperature Epoxy Adhesive TRA-BOND F202 is a clear, low viscosity epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system.. |
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Pot Life | 7200 min | 7200 min | (5 days) |
Tra-Con Tra-Bond F202HV Spectrally Transparent Thixotropic Epoxy Adhesive TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system e.. |
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Pot Life | 7200 min | 7200 min | |
Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot.. |