Processing Properties | Metric | English | Comments |
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Pot Life | 75 min | 75 min | |
Huntsman HY 9130 Polyamide Approx. H+ equivalent weight 95. Mix Ratio with GY 6010 is 50.Comments/Applications: Low viscosity polyamidoamine for solvent free systems. Good mechanical properties. Adhesives, sealants, floor.. |
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Pot Life | 75 - 90 min | 75 - 90 min | 100 gram mass |
Master Bond EP21TDCN Two Component Nickel Conductive Epoxy Adhesive Product Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or .. |
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Pot Life | 75 - 90 min | 75 - 90 min | 100 gram mass |
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Pot Life | 75 - 90 min | 75 - 90 min | 50 gram mass |
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Pot Life | 75 - 90 min | 75 - 90 min | 100 gram batch |
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid.. |
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Pot Life | 75 - 90 min | 75 - 90 min | 50 gm mass |
Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit.. |
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Pot Life | 75 min | 75 min | |
Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting.. |
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Pot Life | 75 min | 75 min | |
Tra-Con Tra-Bond FS163 Medium Viscosity Epoxy/Polyamide Adhesive TRA-BOND FS163 is a medium viscosity polyamide/epoxy adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are r.. |
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Pot Life | 75 min | 75 min | |
Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin.. |
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Pot Life | 75 min @Temperature 25.0 °C |
75 min @Temperature 77.0 °F |
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Trelleborg Emerson & Cuming EP578 Adhesive Density matched blue adhesive for use with EP678, TB610 and TB620.All information provided by Trelleborg Emerson & Cuming |
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Pot Life | 75 - 120 min | 75 - 120 min | 100 gram batch |
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g.. |
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Pot Life | 75 min | 75 min | |
Henkel Hysol EA 9396 Paste Adhesive System Two-part, low viscosity, unfilled version of Hysol EA 9394. Qualified to BMS 8-301.Applications: Structural Repair Low Viscosity Wet Lay-Up Composite Bonding |
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Pot Life | 75 - 120 min | 75 - 120 min | 100 gram batch |
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig.. |