| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 310 - 371 °C | 590 - 700 °F | Injection |
|
Dyna-Purge® E Purging Compound
Designed for Purging High-Temperature Engineering ResinsGeneral Description:DYNA-PURGE E is a high heat-resistant, non-abrasive, non-chemical “engineered†thermoplastic purging compound, f..
|
|||
| Processing Temperature | 310 - 371 °C | 590 - 700 °F | Extrusion |
|
Dyna-Purge® E Purging Compound
Designed for Purging High-Temperature Engineering ResinsGeneral Description:DYNA-PURGE E is a high heat-resistant, non-abrasive, non-chemical “engineered†thermoplastic purging compound, f..
|
|||