Thermal Properties | Metric | English | Comments |
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Heat Distortion Temperature | 155 °C | 311 °F | |
Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther.. |
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Heat Distortion Temperature | 155 °C | 311 °F | ISO 75-2 |
Tisan TISOPLEN® 25% Glass Fiber Reinforced Flame Retardant (V0). Heat Stabilized Copolymer Polypropylene TISOPLEN has a wide area of application in furniture, durable goods, household appliances, electrics/electronics, and telecommunication industries. General specifications include Low densityLow mois.. |
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Heat Distortion Temperature | 155 °C | 311 °F | ISO 75-2 |
Tisan TISOPLEN® 25% Glass Fiber Reinforced Flame Retardant (V0). Heat Stabilized Polypropylene TISOPLEN has a wide area of application in furniture, durable goods, household appliances, electrics/electronics, and telecommunication industries. General specifications include Low densityLow mois.. |