Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 4552 Silicone Glass fiber reinforced silicone molding compound. Excellent thermal stability - up to +/- 300°C continuously, excellent electrical properties, good mechanical strength, very good dimensional stabi.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 4554 Silicone Glass fiber reinforced silicone molding compound. Excellent thermal stability - up to 300°C, exceptional electrical properties, good mechanical strength, very good dimensional stability. Processi.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 6501 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 6502 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 6551 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 6552 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | DIN 52 612 |
Raschig Group AMPLA® 7250 melamine-modified polyester Cellulose reinforced melamine-modified Polyester molding compound. Very good electrical values, excellent heat resistance, excellent surface quality, low post shrinkage. This product meets the allow.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group DECAL® 1760 Phenolic Glass-fiber reinforced phenolic molding compound. Very good electrical properties, good chemical resistance and mechanical properties. This product meets the allowed upper limits for heavy metals an.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group DECAL® 572R Phenolic Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group DECAL® 666/8 Phenolic Glass-fiber reinforced phenolic molding compound with mineral fillers. High heat resistance, reduced mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This prod.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group DECAL® 666/8/2B Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This product meets the allowe.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group DECAL® 937 Phenolic Mica reinforced phenolic molding compound. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (W.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group EPOXIDUR® 3580 EP Epoxy Glass-fiber reinforced and mineral filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties even with thin wall thicknesses and high temperatures. This prod.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on .. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group EPOXIDUR® 3581 T-1 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very .. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group EPOXIDUR® 3582 EP Epoxy Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Moldi.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group EPOXIDUR® 3585 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excel.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group MELOPAS® 156 MF Melamine Glass fiber reinforced Melamine molding compound. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 200.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | DIN 52 612 |
Raschig Group MELOPLAS® 181 MF Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. High surface hardness, good electrical properties, good mechanical strength, high UV and heat resistanc.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RALUPOL® 2200 UP Polyester Organically filled polyester molding compound. Low post-shrinkage, good electrical values and mechanical properties, high surface quality and good color stability (non-yellowing). This product meets.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | Average value: 0.450 W/m-K Grade Count:5 |
Overview of materials for Acetal Copolymer, Carbon Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Acetal Copolymer, Carbon Fiber Filled". Each property range of values reported is minimum and maximum va.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RALUPOL® 8601 UP Glass-fiber reinforced polyester molding compound. Mold shrinkage similar to phenolic moulding compounds, low post-shrinkage, good electrical values, excellent heat resistance, good mechanical stren.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RALUPOL® 8602 UP Glass-fiber reinforced polyester molding compound. Mold shrinkage similar to phenolic molding compounds, low post-shrinkage, good electrical values, excellent heat resistance, good mechanical streng.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RESINOL® 87120 EPF Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets .. |
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Thermal Conductivity | 0.401 - 0.599 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461-92 |
Park Electrochemical Nelco® N4000-11 BC® Buried Capacitance™ Epoxy Laminate and Prepreg The Nelco® N4000-11 is a CAF resistant, high Tg (175º C by DSC) multifunctional epoxy dielectric substrate. This material is formulated to provide the PWB manufacturer and OEM with vastly improved.. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group DECAL® 152CL Phenolic Glass-fiber and mineral reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and mechanical properties. This product meet.. |
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Thermal Conductivity | 0.500 - 0.600 W/m-K | 3.47 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group MELOPLAS® 180 MF Wood flour-reinforced, phenol-modified MF molding compound (MPF) in dark colors. High surface hardness, good mechanical strength and electrical properties, good heat resistance. Self-extinguishing .. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RESINOL® 400 EPF Phenolic Glass-fiber reinforced phenolic molding compound. Excellent heat resistance, low mould shrinkage and post-shrinkage, good chemical resistance and very good mechanical properties. This product meets .. |
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Thermal Conductivity | 0.400 - 0.600 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | Average value: 0.470 W/m-K Grade Count:10 |
Overview of materials for Melamine-Phenolic Copolymer This property data is a summary of similar materials in the MatWeb database for the category "Melamine-Phenolic Copolymer". Each property range of values reported is minimum and maximum values of ap.. |
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Thermal Conductivity | 0.401 - 0.599 W/m-K | 2.78 - 4.16 BTU-in/hr-ft²-°F | ASTM E1461-92 |
Park Electrochemical Nelco® N4000-11 Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-11 is a CAF resistant, high Tg (175º C by DSC) multifunctional epoxy dielectric substrate. This material is formulated to provide the PWB manufacturer and OEM with vastly improved.. |