Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.760 W/m-K @Temperature 80.0 °C |
5.27 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
Rogers Corporation TMM® TMM101 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope.. |
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Thermal Conductivity | 0.760 W/m-K | 5.27 BTU-in/hr-ft²-°F | |
Schott N-FK51A Glass Suitable for precision moldingInformation Provided by SCHOTT North America, Inc. |
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Thermal Conductivity | 0.760 W/m-K | 5.27 BTU-in/hr-ft²-°F | ASTM F433 |
Saint-Gobain Meldin® 5055 Thermoplastic Bearing Material General Notes on Meldin 3000/5000 Series Bearing Products:Injection Moldable, High-Performance Bearings. Can withstand environments of high temperature, corrosive, and water.Specific Notes on Meldin.. |
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Thermal Conductivity | 0.760 W/m-K @Temperature 100 °C |
5.27 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
Plenco 1500 Polyester, Granular, Compression Molded PLENCO 01500 is a general purpose, mineral filled granular polyester molding compound, offering excellent arc and track resistance, and low post shrinkage characteristics. UL recognized under compon.. |
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Thermal Conductivity | 0.760 W/m-K | 5.27 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400.. |
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Thermal Conductivity | 0.760 W/m-K | 5.27 BTU-in/hr-ft²-°F | ASTM C 177 |
Adamas Adalon® 452 PTFE, Mica filler Information provided by Adamas, HPM |