Polymer Property : Thermal Conductivity = 2.50 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Premix Premi-Glas® 2206-15 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2206-15 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Premix Premi-Glas® 2206-22 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2206-22 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Pyrotek Hirolex HG Electrical Insulating Material Hirolex HG has superior mechanical properties. It is highly resistant to thermal shock, non-flammable and offers good arc resistance.Information provided by Pyrotek.
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	ASTM F433
Quadrant EPP Acetron® POM-H Homopolymer Acetal, Unfilled, Extruded (ASTM Product Data Sheet)
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	ASTM E1530
Solvay Specialty Polymers AvaSpire® AV-651 CF30 Polyaryletherketone (PAEK) (Unverified Data**) AvaSpire AV-651 CF30 is a 30% carbon fiber reinforced version of AvaSpire AV-651. This formulation offers some advantages relative to 30% carbon fiber reinforced PEEK which include better dimensiona..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	ASTM F433
Quadrant EPP Duratron® PAI T5030 Polyamide-imide, glass reinforced, extruded (ASTM Product Data Sheet)
Thermal Conductivity	0.360 W/m-K @Temperature 23.9 °C	2.50 BTU-in/hr-ft²-°F @Temperature 75.0 °F	ASTM F-433
PBI Performance Products Celazole® TF-60 V Glass Fiber Reinforced Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. ..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
EVALCA EVAL® LC-E105A Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 44 mol % Ethylene.Data provided by EVALCA. Applications: Cast film, melt phase forming, solid phase pressure forming, tubes, coex coating. EVOH is used in packaging applications because of its out..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ftÂ²-Â°F
Lord Adhesives Circalokâ„¢ 6031 A/B Epoxy Encapsulant Circalokâ„¢ 6031 A/B is a two-part epoxy potting compound with excellent electrical properties at elevated temperatures. Good arc-track resistance under high voltage loading and other dielectric ..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Solvay Specialty Polymers AvaSpireÂ® AV-651 CF30 Polyaryletherketone (PAEK), 30% Carbon Fiber AvaSpireÂ® AV-651 CF30 is a 30% carbon fiber reinforced version of AvaSpireÂ® AV-651. This formulation offers some advantages relative to 30% carbon fiber reinforced PEEK which include better di..
Thermal Conductivity	0.360 W/m-K @Temperature 100 °C	2.50 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 7500 Phenolic, Granular, Transfer Molded PLENCO 07500 is an organic reinforced phenolic molding compound, offering improved mechanical strength and excellent cosmetic characteristics. Type ASTM 5948 CFG and UL recognized under component fi..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
CMT Materials HYTAC® B Solid Polymer Tooling Material Sometimes, finer plug assist details are required which are not obtainable or maintainable with syntactic foam plugs. For these high detail applications, where high toughness and easy machinability ..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® R36211A008 0.008" (0.203 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primerDesign/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: St..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3EG6 30% Glass Filled PA6 (Dry) Ultramid B3EG6 is a 30% glass fiber reinforced injection molding PA6 grade. It conforms to FDA requirements of 21 CFR 177.1500.
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3EG6 BK00564 30% Glass Filled PA6 (Conditioned) Ultramid B3EG6 BK00564 is a 30% glass fiber reinforced, pigmented black injection molding PA6 grade. It conforms to FDA requirements of 21 CFR 177.1500.
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612-1
BASF Ultramid® B3EG6 LS BK 23189 30% Glass Filled PA6 (Conditioned) Information provided by BASF
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612-1
BASF Ultramid® B3EG7 35% Glass Filled PA6 (Conditioned) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3WG6 BK00564 30% Glass Filled PA6 (Conditioned) Ultramid B3WG6 BK00564 is a 30% glass fiber reinforced, pigmented black, heat stabilized injection molding PA6 grade.
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	Product Property; ASTM E 1530
Arlon R36601A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Sty..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultradur® B 4300 G10 50% Glass Filled PBT Description: Injection-molding grades containing 50% of glass fibers, for industrial parts, rigid, tough and dimensionally stable, for example for program switches, thermostat parts, small-motor hou..
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3WG6 30% Glass Filled PA6 (Dry) Ultramid B3WG6 is a 30% glass fiber reinforced, heat stabilized injection molding PA6 grade.
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3WG6 BK00564 30% Glass Filled PA6 (Dry) Ultramid B3WG6 BK00564 is a 30% glass fiber reinforced, pigmented black, heat stabilized injection molding PA6 grade.