Polymer Property : Thermal Conductivity = 0.972 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Pyrotek NT-C Electrical Insulating Material NT-C offers superior arc and heat resistance properties, with adequate strength properties to withstand mechanical stress and hold up in severe electrical insulating applications. NT-C does not pro..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1385 Black Epoxy Formulation Resinlab™ EP1385 Black is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1385 Clear Epoxy Formulation Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Thermal Conductivity	0.140 - 1.76 W/m-K	0.972 - 12.2 BTU-in/hr-ft²-°F	Average value: 0.570 W/m-K Grade Count:22
Overview of materials for Thermoset Polyurethane, Adhesive This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Adhesive". Each property range of values reported is minimum and maximum values ..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	ISO 8302
SABIC Innovative Plastics Lexan® FL920 PC (Europe-Africa-Middle East) LEXAN FL920 is a foamable grade of LEXAN polycarbonate, containing 20% glass-fibre is designed of applications where superior flexural and tensile charasterics are required. LEXAN FL920 also offers ..
Thermal Conductivity	0.140 - 0.190 W/m-K	0.972 - 1.32 BTU-in/hr-ft²-°F	Average value: 0.162 W/m-K Grade Count:4
Overview of materials for PVC, Extruded This property data is a summary of similar materials in the MatWeb database for the category "PVC, Extruded". Each property range of values reported is minimum and maximum values of appropriate MatW..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Schwartz Technical Plastics LAMIGAMIDÂ® 710 High Density Polyethylene Application: chain-guides, cutting plates, linersInformation provided by Schwartz Technical Plastics GmbH
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	Melt
Covestro Desmopan® 3385A Polyurethane Extrusion- and injection molding gradegood wear resistanceshort cycle timeshigh melt stabilityApplicationhard - soft systemsHosesnon-reinforcedProfilesInjection molded engineering partsPreprocessing..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	Melt
Covestro Desmopan® 790 Polyurethane Extrusion- and injection molding gradehigh mechanical strengthApplicationToothed beltsProfilesInjection molded engineering partsPreprocessingMax. Water content
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	of melt
DuPont Performance Polymers Zytel® EFE1068 NC010T Nylon 66 (Unverified Data**) Unreinforced Polyamide 66Zytel EFE1068 NC010T is a lubricated polyamide 66 for injection molding. It has excellent flow characteristics and was developed for fast production cycles and high producti..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	cured 10 mins @ 150°C
ACC QLE 1050 QSI Quantum Silicones 30 Durometer Clear, Addition Cure, 1-part Elastomer for Coating QLE 1050 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® UR3005 Clear Two Part Urethane Elastomer Resinlab™ UR 3005 Clear is a two component, room temperature curing polybutadiene polyurethane casting and potting system. It is designed to cure completely at room temperature. UR 3005 Clear provi..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® UR3005 Two Part Urethane Elastomer Resinlab™ UR 3005 is a two component, room temperature curing polybutadiene polyurethane casting and potting system. It is designed to cure completely at room temperature. UR 3005 provides excellen..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	DIN 52612
GEHR Plastics PVC-U Polyvinylchloride Polyvinyl chloride is a flame retardant material with an exceptional chemical resistance and also with lower stress cracking. PVC-U shows high mechanical strength, tensile strength and the continuou..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Elisto THERMOSTAR® LC 6000 Insulation Material Pattern material. Insulation materials for mechanical engineering.Information provided by elisto
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th..
Thermal Conductivity	0.140 - 0.390 W/m-K	0.972 - 2.71 BTU-in/hr-ft²-°F	Average value: 0.284 W/m-K Grade Count:5
Overview of materials for Thermoset Polyurethane, Elastomer, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Elastomer, Unreinforced". Each property range of values reported is minimum and ..