Polymer Property : Thermal Conductivity = 1.46 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English
Thermal Conductivity	1.46 W/m-K	10.1 BTU-in/hr-ft²-°F
Mykroy/Mycalex MM 561 Molding Grade Glass-bonded Mica Composite Synthetic mica filler. Does not burn. Good radiation resistance (3 x 10^10 Rads-Cobalt). ROHS CompliantThis ceramoplastic material is a versatile and efficient insulating material designed to meet..
Thermal Conductivity	1.46 W/m-K	10.1 BTU-in/hr-ftÂ²-Â°F
Misumi Machinable SiO2-MgO Ceramic Information provided by MISUMI Corporation.
Thermal Conductivity	1.46 W/m-K	10.1 BTU-in/hr-ft²-°F
Corning Macor® Machinable Glass Ceramic The CTE of Macor® matches most metals and sealing glasses. It is nonwetting, exhibits zero porosity, and, unlike ductile materials, will not deform. It is an excellent insulator at high voltages,..
Thermal Conductivity	1.46 W/m-K	10.1 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Thermal Conductivity	1.46 W/m-K	10.2 BTU-in/hr-ft²-°F
Aremco AREMCOLOX™ 502-800 Macor Glass Ceramic (Unverified Data**) Recommended for temperatures to 1472°F (800°C) and peaks up to 1832°F (1000°C). Demonstrates low thermal conductivity, high strength, high electrical insulation, zero porosity, non-wetting, and ..
Thermal Conductivity	1.46 W/m-K	10.1 BTU-in/hr-ft²-°F
Atom Adhesives AA-DUCT N02 Epoxy Adhesive AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures makin..