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- Polymer Property : Thermal Conductivity = 1.00 W/m-K
Polymer Property : Thermal Conductivity = 1.00 W/m-K Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | ASTM D5470 |
| Parker Chomerics THERM-A-GAP™ G174 Cost Effective Gap Filler Description: THERM-A-GAP™ elastomers are used to fill air gaps between PC boards or other components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced .. |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | through-plane, 10*10*3mm sample; ASTM E 1461-07 |
| SABIC Innovative Plastics LNP KONDUIT OX11314 PPS (Asia Pacific) Thermally conductive mineral filled PPS FR compound |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive. |
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| Thermal Conductivity | 1.00 - 3.00 W/m-K @Temperature 50.0 - 100 °C |
6.94 - 20.8 BTU-in/hr-ft²-°F @Temperature 122 - 212 °F |
Average value: 1.94 W/m-K Grade Count:14 |
| Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val.. |
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| Thermal Conductivity | <= 1.00 W/m-K | <= 6.94 BTU-in/hr-ft²-°F | |
| MarkeTech MC-LD and MC-MD Ultra High Temperature Machinable Ceramics For very high temperatures or where thermal conductivity or thermal shock is important, these machinable alkaline/alkaline earth zirconium phosphate ceramics (NaZr2P3O12 or BaZr4P6O24) are recommend.. |
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| Thermal Conductivity | 1.00 W/m-K @Temperature 90.0 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8405 UV-transmitting Glass Sodium-potassium-barium-silicate glass, highly UV-transmitting Used as envelope for germicidal lamps (low-pressure mercury vapor discharge lamps) and for UV detectors The heavy metal content for t.. |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
| Schott N-SF1 Glass Information Provided by SCHOTT North America, Inc. |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
| Schott N-SF14 Glass Information Provided by SCHOTT North America, Inc. |
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| Thermal Conductivity | 1.00 W/m-K @Temperature 90.0 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8337B Borosilicate Glass Borosilicate glass for sealing to Kovar metal and tungsten, highly UV-transmitting photomultiplier and UV detectors The heavy metal content for the elements lead, cadmium, mercury, and hexavalent .. |
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| Thermal Conductivity | 1.00 W/m-K @Temperature 121 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 250 °F |
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| Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
| Trelleborg Emerson & Cuming Stycast® 4952/25 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | through plane; ASTM E1461 |
| DSM Stanyl® TC153 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | in plane; ASTM E1461 |
| DSM Stanyl® TC154 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized |
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| Thermal Conductivity | 1.00 W/m-K @Temperature 100 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 212 °F |
Silicone Property; ASTM E1530 |
| Arlon Thermabond® R37260N008 0.008" Uncured Silicone Rubber on Fiberglass Carrier Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction:Liner: 1 mil FEPProduct: Uncured Silicone RubberCarrier: 3 m.. |
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| Thermal Conductivity | 1.00 W/m-K @Pressure 2.07 MPa |
6.94 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
| Parker Chomerics CHO-SEAL® 6502 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric.. |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3UGM210 GR 22866 10/50% Glass/Mineral Filled PA6 FR (Conditioned) Description: Halogen- and phosphorus-free injection-molding grade with very high rigidity, low smoke density and outstanding electrical properties.Information provided by BASF |
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| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3UGM210 GR 22866 10/50% Glass/Mineral Filled PA6 FR (Dry) Description: Halogen- and phosphorus-free injection-molding grade with very high rigidity, low smoke density and outstanding electrical properties.Information provided by BASF |
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