Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 0.980 W/m-K | 6.80 BTU-in/hr-ft²-°F | through-plane, ø80*3mm discs; ISO 22007-2 |
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Asia Pacific) Thermally conductive mineral filled PA6 FR compounding |
|||
Thermal Conductivity | 0.980 W/m-K | 6.80 BTU-in/hr-ft²-°F | ASTM C177 |
Techmer ES HiFill® PA4/6 0206 Availability: North AmericaForms: PelletsFeatures: High Specific Gravity and Thermally ConductiveInformation provided by TP Composites, Inc. |
|||
Thermal Conductivity | 0.980 W/m-K | 6.80 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
|||
Thermal Conductivity | 0.980 W/m-K | 6.80 BTU-in/hr-ft²-°F | through-plane, ø80*3mm discs; ISO 22007-2 |
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Europe-Africa-Middle East) Thermally conductive mineral and glass fiber filled PA6, FR, compliant with ECO protocols, non-brominated, non-chlorinated |