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- Polymer Property : Thermal Conductivity = 0.360 W/m-K
Polymer Property : Thermal Conductivity = 0.360 W/m-K Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Premix Premi-Glas® 2206-22 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2206-22 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Premix Premi-Glas® 2206-25 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2206-25 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM F433 |
| Quadrant EPP Acetron® POM-H Homopolymer Acetal, Unfilled, Extruded (ASTM Product Data Sheet) |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| Thermal Conductivity | 0.360 W/m-K @Temperature 23.9 °C |
2.50 BTU-in/hr-ft²-°F @Temperature 75.0 °F |
ASTM F-433 |
| PBI Performance Products Celazole® TF-60 V Glass Fiber Reinforced Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. .. |
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| Thermal Conductivity | >= 0.360 W/m-K | >= 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| PolyOne Edgetek® PF-40GF/000 Polysulfone, Glass Filled
(discontinued **) Description/Features:Glass Fiber ReinforcedUL 94 V0PolyOne First ChoiceInformation provided by PolyOne Corporation. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 20-0665 Polyphthalamide, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Low influence from moisture an.. |
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| Thermal Conductivity | 0.360 - 0.504 W/m-K | 2.50 - 3.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Garlock 9405 PTFE Rubber Sheet, 25% Glass Filled Premium Grade 25% Glass-filled Skived PTFE SheetInformation provided by Garlock Rubber Technologies |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Lord Adhesives Circalokâ„¢ 6031 A/B Epoxy Encapsulant Circalokâ„¢ 6031 A/B is a two-part epoxy potting compound with excellent electrical properties at elevated temperatures. Good arc-track resistance under high voltage loading and other dielectric .. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Solvay Specialty Polymers AvaSpire® AV-651 CF30 Polyaryletherketone (PAEK), 30% Carbon Fiber AvaSpire® AV-651 CF30 is a 30% carbon fiber reinforced version of AvaSpire® AV-651. This formulation offers some advantages relative to 30% carbon fiber reinforced PEEK which include better di.. |
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| Thermal Conductivity | 0.360 W/m-K @Temperature 100 °C |
2.50 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
| Plenco 2300 Phenolic, Granular, Compression Molded PLENCO 02300 is a general purpose organic filled molding compound formulated to offer excellent processability while maintaining mechanical strength values. UL recognized under component file E40654.. |
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| Thermal Conductivity | 0.360 W/m-K @Temperature 100 °C |
2.50 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
| Plenco 7500 Phenolic, Granular, Transfer Molded PLENCO 07500 is an organic reinforced phenolic molding compound, offering improved mechanical strength and excellent cosmetic characteristics. Type ASTM 5948 CFG and UL recognized under component fi.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3EG6 30% Glass Filled PA6 (Dry) Ultramid B3EG6 is a 30% glass fiber reinforced injection molding PA6 grade. It conforms to FDA requirements of 21 CFR 177.1500. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3EG6 BK00564 30% Glass Filled PA6 (Dry) Ultramid B3EG6 BK00564 is a 30% glass fiber reinforced, pigmented black injection molding PA6 grade. It conforms to FDA requirements of 21 CFR 177.1500. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG6 LS BK 23189 30% Glass Filled PA6 (Dry) Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG7 35% Glass Filled PA6 (Conditioned) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG7 35% Glass Filled PA6 (Dry) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG7 BK 00564 35% Glass Filled PA6 (Dry) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3ZG8 BK 20560 40% Glass Filled PA6-1 (Dry) Description: Impact-modified and 40% glass-fiber reinforced injection-molding grade for technical articles of very high stiffness and toughness, for instance, for vehicle airbag housings and suitcas.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3WG6 BK00564 30% Glass Filled PA6 (Conditioned) Ultramid B3WG6 BK00564 is a 30% glass fiber reinforced, pigmented black, heat stabilized injection molding PA6 grade. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3WG7 BK 00564 30% Glass Filled PA6 (Dry) Description: 35% glass-fiber reinforced and heat aging resistant injection-molding grade, e.g. for automotive manifolds and pedals.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C-518 |
| Sumitomo Bakelite North America FS-10-VO-200-P Short-Glass Reinforced Diallyl Phthalate Short glass fiber reinforced, flame retardant, diallyl meta-phthalate molding compound with excellent heat resistance.Meets the requirements of ASTM D5948 Type SIG-F.Information provided by Vyncolit.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C-518 |
| Sumitomo Bakelite North America FS-5 Short-Glass Reinforced Diallyl Phthalate Short glass fiber reinforced, non-flame retardant, diallyl meta-phthalate molding compound which meets the requirements of ASTM D5948 TYPE SIG.Information provided by Vyncolit, a Sumitomo Bak Group |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | Product Property; ASTM E 1530 |
| Arlon R36601A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Sty.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Quantum Acetal-Homopolymer Information provided by Quantum Advanced Engineering Plastics |
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