Polymer Property : Thermal Conductivity = 0.140 W/m-K Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1290 Clear Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Clear is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to ..
Thermal Conductivity	0.140 W/m-K @Temperature 250 °C	0.972 BTU-in/hr-ft²-°F @Temperature 482 °F
Pyrotek Wollite 30 Insulating Castable Wollite material is a solid, light weight mineral foam which is stable during its preparation and during subsequent curing and drying. Because of the foam properties it is well suited for casting c..
Thermal Conductivity	0.140 W/m-K @Temperature 250 °C	0.972 BTU-in/hr-ft²-°F @Temperature 482 °F
Pyrotek Wollite 37 Insulating Castable Wollite material is a solid, light weight mineral foam which is stable during its preparation and during subsequent curing and drying. Because of the foam properties it is well suited for casting c..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1385 Black Epoxy Formulation Resinlab™ EP1385 Black is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Thermal Conductivity	0.140 - 0.190 W/m-K	0.972 - 1.32 BTU-in/hr-ft²-°F	Average value: 0.162 W/m-K Grade Count:4
Overview of materials for PVC, Extruded This property data is a summary of similar materials in the MatWeb database for the category "PVC, Extruded". Each property range of values reported is minimum and maximum values of appropriate MatW..
Thermal Conductivity	0.140 - 3.46 W/m-K	0.972 - 24.0 BTU-in/hr-ft²-°F	Average value: 0.723 W/m-K Grade Count:74
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Thermal Conductivity	0.140 - 1.28 W/m-K	0.972 - 8.88 BTU-in/hr-ft²-°F	Average value: 0.510 W/m-K Grade Count:28
Overview of materials for Epoxy Cure Resin This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Cure Resin". Each property range of values reported is minimum and maximum values of appropriate M..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Natural Rubber, Not Vulcanized (NR, IR, Polyisoprene) Natural rubber is polyisoprene. Chemical and environmental resistance and mechanical properties are improved through crosslinking (vulcanizing), usually through treatment with sulfur.Natural rubber..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	Melt
Covestro Desmopan® 790 Polyurethane Extrusion- and injection molding gradehigh mechanical strengthApplicationToothed beltsProfilesInjection molded engineering partsPreprocessingMax. Water content
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	ASTM C177
CPC - Vycom FLAMETEC™ CPVC Chlorinated Polyvinyl Chloride Sheet Flametec™ CPVC made from Corzan® 4910 white 120 compound is a high heat, corrosion resistant chlorinated polyvinyl chloride sheet. Because of its excellent corrosion resistance at elevated tempera..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	of melt
DuPont Performance Polymers Zytel® EFE1068 NC010T Nylon 66 (Unverified Data**) Unreinforced Polyamide 66Zytel EFE1068 NC010T is a lubricated polyamide 66 for injection molding. It has excellent flow characteristics and was developed for fast production cycles and high producti..
Thermal Conductivity	0.140 W/m-K @Temperature 50.0 °C	0.972 BTU-in/hr-ft²-°F @Temperature 122 °F
3M S42XHS Glass Bubbles 3M™ Glass Bubbles S42XHS are high-strength additives for polymers made from a water-resistant and chemically stable sodalime-borosilicate glass. These hollow glass microspheres can be compounded wi..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	cured 10 mins @ 150°C
ACC QLE 1050 QSI Quantum Silicones 30 Durometer Clear, Addition Cure, 1-part Elastomer for Coating QLE 1050 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1290 Gray Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Gray is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to m..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® UR3005 Two Part Urethane Elastomer Resinlab™ UR 3005 is a two component, room temperature curing polybutadiene polyurethane casting and potting system. It is designed to cure completely at room temperature. UR 3005 provides excellen..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F	DIN 52612
GEHR Plastics PVC-U Polyvinylchloride Polyvinyl chloride is a flame retardant material with an exceptional chemical resistance and also with lower stress cracking. PVC-U shows high mechanical strength, tensile strength and the continuou..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Elisto THERMOSTAR® LC 6000 Insulation Material Pattern material. Insulation materials for mechanical engineering.Information provided by elisto
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Thermal Conductivity	0.140 W/m-K	0.972 BTU-in/hr-ft²-°F
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th..
Thermal Conductivity	0.140 - 0.390 W/m-K	0.972 - 2.71 BTU-in/hr-ft²-°F	Average value: 0.284 W/m-K Grade Count:5
Overview of materials for Thermoset Polyurethane, Elastomer, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Elastomer, Unreinforced". Each property range of values reported is minimum and ..