Thermal Properties | Metric | English | Comments |
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CTE, linear | 54.0 µm/m-°C @Temperature 17.0 - 37.0 °C |
30.0 µin/in-°F @Temperature 62.6 - 98.6 °F |
ASTM D696 |
Plaskolite PL-24 Acrylic Resin For injection molding. An unlubricated version of PL-25 extrusion grade pellets. Highest molecular weight, maximum heat resistance.Information supplied by the manufacturer. |
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CTE, linear | 54.0 µm/m-°C @Temperature -18.0 - 38.0 °C |
30.0 µin/in-°F @Temperature -0.400 - 100 °F |
ASTM D696 |
Plaskolite Optix® SG Sign Grade Acrylic Sheet Available in unlimited lengths - no seams in finished products.Data provided by the manufacturer, Plaskolite, Inc. |
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CTE, linear | 54.0 - 340 µm/m-°C | 30.0 - 189 µin/in-°F | Average value: 233 µm/m-°C Grade Count:49 |
Overview of materials for Silicone, RTV, Adhesive/Sealant Grade This property data is a summary of similar materials in the MatWeb database for the category "Silicone, RTV, Adhesive/Sealant Grade". Each property range of values reported is minimum and maximum va.. |
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CTE, linear | 54.0 µm/m-°C @Temperature -40.0 - 176 °C |
30.0 µin/in-°F @Temperature -40.0 - 349 °F |
ASTM D696 |
Ravago Manufacturing Americas Hylac® FR134G10 ABS, 10% Glass Fiber Reinforced Entec's proprietary products include a full range of compounds in the Nylon 6/6, Nylon 6, ABS, PBT, Polycarbonate, PC/ABS, PC/ASA, PC/PBT, and PPO/PPE resin families.Information provided by Rava.. |
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CTE, linear | 54.0 µm/m-°C @Temperature -18.0 - 38.0 °C |
30.0 µin/in-°F @Temperature -0.400 - 100 °F |
ASTM D696 |
Plaskolite Optix® PL-30 Acrylic Resin
(discontinued **) Injection molding and extrusion grade pellets. Highest molecular weight and heat resistance of Optix® line with exceptional mold release.Data provided by the manufacturer, Plaskolite, Inc. |
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CTE, linear | 54.0 µm/m-°C @Temperature -18.0 - 38.0 °C |
30.0 µin/in-°F @Temperature -0.400 - 100 °F |
ASTM D696 |
Plaskolite Optix® PL-52 Acrylic Resin
(discontinued **) Injection/extrusion pellets. High heat resistance/medium flow.Data provided by the manufacturer, Plaskolite, Inc. |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
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Resin Technology Group TIGA 110-EXDP Low Viscosity, Optically Clear Glass Bonder Mix ratio 100/50 by volume.TIGA 110EX-DP is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarit.. |
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CTE, linear | 54.0 - 55.0 µm/m-°C @Temperature 73.0 - 200 °C |
30.0 - 30.6 µin/in-°F @Temperature 163 - 392 °F |
Average value: 54.5 µm/m-°C Grade Count:2 |
Overview of materials for Thermoplastic Polyimide, Unfilled |
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CTE, linear | 54.0 µm/m-°C @Temperature -40.0 - 150 °C |
30.0 µin/in-°F @Temperature -40.0 - 302 °F |
ASTM E831 |
Quadrant EPP Fluorosint® MT-01 Enhanced PTFE (ASTM Product Data Sheet)
(Unverified Data**) |
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CTE, linear | 54.0 - 144 µm/m-°C @Temperature 25.6 - 204 °C |
30.0 - 80.0 µin/in-°F @Temperature 78.0 - 400 °F |
ASTM D696 |
Technetics Group Texolon™ 9406 PTFE
(Unverified Data**) General purpose 25% glass filled PTFE for applications less demandingPTFE CharacteristicsChemical ResistanceThermal StabilityCryogenic PropertiesLow Coefficient of FrictionLow Surface EnergyLow Diel.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
LyondellBasell SEQUEL® 1825 Engineered Polyolefin Description: SEQUEL® 1825 engineered polyolefin is designed for automotive applications that require energy management combined with ductility and a balance of stiffness and impact resistance ove.. |
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CTE, linear | 54.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
30.0 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
Borealis Daplen™ EF341AE Polypropylene TPO Compound Daplen™ EF341AE is a 30% mineral filled elastomer modified polypropylene compound intended for injection molding. This material has excellent balanced mechanical properties, gives a good surface q.. |
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CTE, linear | 54.0 µm/m-°C | 30.0 µin/in-°F | |
Unifrax Fiberfrax® QF-180™ Coating Cement Fiberfrax QF-180™, QF-180™ Blue, and QF-150™ coating cements provide a range of consistencies for brush, spray, and trowel-on application. These coatings have 1260°C (2300°F) temperature grade.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.0 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 1501 Polyester, Briquette, Transfer Molded PLENCO 01501 is a general purpose, mineral filled granular polyester molding compound, offering excellent arc and track resistance properties, low post shrinkage, and improved mechanical strength va.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.0 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 1530 Polyester, Briquette, Transfer Molded PLENCO 01530 is a glass and mineral reinforced pelletized polyester molding compound, offering improved mechanical strength properties along with excellent electrical properties and dimensional stab.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.0 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 7080 Phenolic, Nodular, Compression Molded PLENCO 07080 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength properties along with outstanding resistance to cracking and degradation from soap and de.. |
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CTE, linear | 54.0 µm/m-°C | 30.0 µin/in-°F | |
Hexcel® HexPly® F593 Epoxy Resin HexPly® F593 is a modified 350°F (177°C) curing epoxy system with very low flow for carbon fabric and tape applications that provides excellent laminate and honeycomb sandwich properties. As a lo.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.0 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 2408 Phenolic, Granular, Injection Molded PLENCO 02408 is a general purpose, organic filled phenolic molding compound, offering excellent cosmetic characteristics and improved electrical strength properties. UL recognized under component fi.. |
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CTE, linear | 54.0 µm/m-°C | 30.0 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T.. |
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CTE, linear | 54.0 µm/m-°C | 30.0 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® bra.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Asahi Kasei Thermylene® P6-10FG-0600 10% Glass Fiber Reinforced, Heat Stabilized Information provided by Asahi Thermofil |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Asahi Kasei Thermylene® P6-10FG-Y950 10% Glass Fiber Reinforced, Lubricated Information provided by Asahi Thermofil |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
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Aremco Aremco-Bond™ 657 High Performance Epoxide Stainless Steel-Filled, High Corrosion Resistance. |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Asahi Kasei Thermylene® P1-10FG-8100 10% Glass Fiber Reinforced, Heat Stabilized Information provided by Asahi Thermofil |
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CTE, linear | 54.0 µm/m-°C | 30.0 µin/in-°F | |
Unifrax Fiberfrax® QF-150™ Coating Cement Fiberfrax QF-180™, QF-180™ Blue, and QF-150™ coating cements provide a range of consistencies for brush, spray, and trowel-on application. These coatings have 1260°C (2300°F) temperature grade.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
ASTM data |
BASF Capron® 8360 HS 34% Mineral-Filled Nylon 6 (Dry)
(discontinued **) Capron 8360 HS is a heat stabilized 34% mineral reinforced nylon 6 injection molding resin possessing a high level of toughness and ductility combined with excellent processability and surface aesth.. |
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CTE, linear | 54.0 µm/m-°C | 30.0 µin/in-°F | |
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.0 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 1510 Polyester, Granular, Transfer Molded PLENCO 01510 is a mineral filled, pelletized polyester molding compound, which offers an excellent combination of electrical properties and dimensional stability. UL recognized under component file .. |
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CTE, linear | 54.0 - 90.0 µm/m-°C | 30.0 - 50.0 µin/in-°F | Average value: 72.0 µm/m-°C Grade Count:5 |
Overview of materials for Acrylic, Impact Modified Sheet This property data is a summary of similar materials in the MatWeb database for the category "Acrylic, Impact Modified Sheet". Each property range of values reported is minimum and maximum values of.. |