Thermal Properties | Metric | English | Comments |
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CTE, linear | 53.0 - 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 - 29.4 µin/in-°F @Temperature 104 - 266 °F |
Average value: 53.0 µm/m-°C Grade Count:1 |
Overview of materials for Phenolic/Rubber; Molded This property data is a summary of similar materials in the MatWeb database for the category "Phenolic/Rubber; Molded". Each property range of values reported is minimum and maximum values of approp.. |
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CTE, linear | 53.0 - 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 - 29.4 µin/in-°F @Temperature 104 - 266 °F |
Average value: 53.0 µm/m-°C Grade Count:1 |
Overview of materials for Phenolic, Resole, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Mineral Filled". Each property range of values reported is minimum and maximum values .. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 00732 Melamine-Phenolic, Granular, Transfer Molded PLENCO 00732 is a melamine-phenolic copolymer molding compound, exhibiting excellent electrical and flame resistant properties. Type ASTM 5948 CMG, and UL recognized under component file E40654. 007.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4327 Phenolic, Granular, Compression Molded PLENCO 04327 is a heat resistant mineral filled phenolic molding compound offering excellent cosmetic characteristics and improved heat resistant properties. PLENCO 04327 is not intended for electri.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4485 Phenolic, Granular, Compression Molded PLENCO 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is a.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 40.0 - 130 °C |
29.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 6582 Phenolic, Briquette, Injection Molded PLENCO 06582 is a rubber modified phenolic molding compound, offering excellent heat resistant properties, along with improved mechanical strength at elevated temperatures. UL recognized under compo.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | ISO 11359-2 |
Unitika M1030DH PA6, Dry Nano composite nylonInformation provided by Unitika Ltd. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA12 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admin.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA16 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-16 EPOXY ADHESIVE is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests,.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA8 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food an.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | ISO 11359-2 |
Unitika M1030DH PA6, Conditioned Nano composite nylonInformation provided by Unitika Ltd. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-701 Epoxy Adhesive A one-component, light gray, thixotropic, non-sag epoxy adhesive. A-701 uses an inert oxide filler that provides excellent electrical insulation properties. Features high temperature, 400°F, bond.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-706 Epoxy Adhesive A one-component, gray, aluminum-filled, thixotropic, non-sag epoxy adhesive. A-706 has an in-service temperature range to 400°F, but requires 350°F minimum cure temperature. Features excellent m.. |
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CTE, linear | 52.9 µm/m-°C | 29.4 µin/in-°F | |
Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei.. |
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CTE, linear | 52.9 µm/m-°C | 29.4 µin/in-°F | |
Atom Adhesives AA-BOND FDA2T Epoxy Adhesive AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received .. |
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CTE, linear | 52.9 µm/m-°C | 29.4 µin/in-°F | |
Atom Adhesives AA-BOND FDA8 Epoxy Adhesive AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and .. |
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CTE, linear | 52.9 µm/m-°C | 29.4 µin/in-°F | |
Atom Adhesives AA-BOND FDA16 Epoxy Adhesive AA-BOND FDA16 is a medium viscosity epoxy resin system specifically developed for medical device applications. AA-BOND FDA16 has been tested in accordance with USP biological reactivity tests, in vi.. |
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CTE, linear | 53.0 µm/m-°C @Temperature -50.0 - 50.0 °C |
29.4 µin/in-°F @Temperature -58.0 - 122 °F |
Axial; ASTM E831 |
Chevron Phillips Ryton® PR09-60 Polyphenylene Sulfide Compound
(discontinued **) Polyphenylene Sulfide CompoundRyton® PR09-60 is pelletized unfilled high molecular weight polyphenylene sulfide resin suitable for extrusion or injection molding.Comments: Test specimen molding con.. |
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CTE, linear | 53.0 µm/m-°C @Temperature 20.0 °C |
29.4 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
GEHR Plastics PPS Polyphenylene Sulfide The linear polyphenylensulfide belongs to the semi-crystalline materials and offers a very high mechanical capacity, thermal and chemical resistance distinguished at the same time, high dimensional .. |
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CTE, linear | 53.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
29.4 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
Solvay Engineered Polymers DEXFLEX® 925 TPO
(discontinued **) Description: DEXFLEX® 925 is a thermoplastic olefinic elastomer (TPO) designed for automotive exterior applications that require a combination of stiffness, low-temperature impact resistance, and e.. |
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CTE, linear | 53.0 µm/m-°C | 29.4 µin/in-°F | ASTM E831-93 |
Saint-Gobain Meldin® 2001 Bearing General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Series ca.. |