Polymer Property : CTE, linear = 19.4 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 100 °C	19.4 µin/in-°F @Temperature 73.4 - 212 °F
Quadrant EPP Duratron® PAI T4301 PAI + graphite + PTFE, extruded (ISO Data) The addition of PTFE and graphite provides higher wear resistance and lower coefficient of friction compared to the unfilled grade as well as a lower tendency to stick-slip. Duratron T4301 PAI also ..
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 100 °C	19.4 µin/in-°F @Temperature 73.4 - 212 °F
Quadrant EPP Ketron® HPV PEEK + carbon fibres + PTFE + graphite, bearing grade, extruded (ISO Data) The addition of carbon fibres, PTFE and graphite to virgin PEEK results in a Ketron PEEK “bearing grade”. Its excellent tribological properties (low friction, long wear and high pressure-velocity ..
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 100 °C	19.4 µin/in-°F @Temperature 73.4 - 212 °F
Quadrant EPP Semitron® ESd 520HR PAI, static dissipative, extruded (ISO Data) Semitron ESd 520HR has an industry first combination of electrostatic dissipation (ESd), high strength and heat resistance. This new ESd material is ideal for making nests, sockets and contactors fo..
CTE, linear	35.0 Âµm/m-Â°C	19.4 Âµin/in-Â°F	DIN 53752
Lehmann & Voss LUVOCOMÂ® 19-7221/OR Polyamide 46, with glass fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Strong, stiff parts.Highly dimensionally stable at elevated temperatures.Gear parts for automot..
CTE, linear	35.0 - 40.0 µm/m-°C	19.4 - 22.2 µin/in-°F
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit..
CTE, linear	35.0 - 40.0 µm/m-°C	19.4 - 22.2 µin/in-°F
Master Bond EP45HTND-2 Chemically Resistant, Non-Drip Epoxy Description: Master Bond EP45HTND-2 is a two component epoxy system for high performance bonding, sealing and coating. It is used for applications requiring solid temperature resistance and capable ..
CTE, linear	35.0 µm/m-°C @Temperature 20.0 °C	19.4 µin/in-°F @Temperature 68.0 °F	ASTM D696
Toyobo T-400 Nylon, 15% Glass-Reinforced Key Feature: G.F. 15%Information provided by Toyobo Co., Ltd
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	Below Tg
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi..
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	Below Tg
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
CTE, linear	35.0 µm/m-°C @Temperature 20.0 °C	19.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Cast 3108 General Purpose Epoxy Casting Compound TRA-CAST 3108 is a low viscosity two-part formulation recommended for underfill and encapsulating applications where the combination of good mechanical thermal and electrical properties are required..
CTE, linear	35.0 µm/m-°C @Temperature 20.0 °C	19.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Cast 3113 General Purpose Epoxy Casting Compound TRA-CAST 3113 is a low viscosity two-part formulation recommended for general purpose electrical potting and encapsulating applications where the combination of good mechanical thermal and electrica..
CTE, linear	35.0 µm/m-°C @Temperature 25.0 - 450 °C	19.4 µin/in-°F @Temperature 77.0 - 842 °F	ASTM E233
UBE UPIMOL® SA101 Heat-Resistant Polyimide Shape Description: UPIMOL® SA101 is an excellent heat-resistant polyimide shape, based on Biphenyl tetracarboxilic dianhydride(BPDA) originally developed by UBE. UPIMOL® SA101 has improved high durabili..
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	ASTM D696
Unitika UG-100-30 Engineering Plastic Excellent creep resistance, dimensional stability at high temperatureInformation provided by Unitika Ltd.
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 80.0 °C	19.4 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6000 GS 50 HWCP 50% Glass Sphere Filled Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 80.0 °C	19.4 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6000 GV 15 HWCP 15% Glass Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 80.0 °C	19.4 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6600 GV 15 HWCP 15% Glass Fiber Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 80.0 °C	19.4 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6600 MRGV 25/15 HWCP 25% Mineral and 15% Glass Fiber Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i..
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	ASTM E831
Addiplast Addinyl B2 V20 Nylon 6. 20% Glass Filled Glass fiber reinforced, high strengthInformation provided by Addiplast.
CTE, linear	35.0 µm/m-°C @Temperature 20.0 °C	19.4 µin/in-°F @Temperature 68.0 °F
Armstrong A-661 Epoxy Adhesive A truly unique, two-component, room temperature curing thixotropic epoxy adhesive system, which exhibits good bond strength at service temperatures up to 400°F. Ideal for applications where resist..
CTE, linear	34.9 µm/m-°C	19.4 µin/in-°F
Atom Adhesives AA-DUCT 2919 Epoxy Adhesive AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled w..
CTE, linear	35.0 µm/m-°C @Temperature -30.0 - 30.0 °C	19.4 µin/in-°F @Temperature -22.0 - 86.0 °F	ASTM D696
Beijing Chemical Industry KAIFA® 301-G20 PBT Resin 20% glass fiber reinforced, flame retardantInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear	35.0 µm/m-°C @Temperature 23.0 - 100 °C	19.4 µin/in-°F @Temperature 73.4 - 212 °F
Quadrant EPP Duratron® PAI T5530 PAI, 30% glass fibers, compression moulded (ISO Data) This 30 % glass fibre reinforced grade offers higher stiffness, strength and creep resistance than the Duratron PAI grades mentioned above. It is well suited for structural applications supporting s..
CTE, linear	35.0 - 40.0 µm/m-°C	19.4 - 22.2 µin/in-°F
Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding ..