Thermal Properties | Metric | English | Comments |
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CTE, linear | 190 µm/m-°C @Temperature 23.0 - 100 °C |
106 µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP Symalit® 1000 PVDF unfilled, extruded (ISO Data) Symalit 1000 PVDF is a highly crystalline unreinforced fluoropolymer combining good mechanical, thermal and electrical properties with excellent chemical resistance. It also shows good resistance to.. |
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CTE, linear | 191 µm/m-°C @Temperature 20.0 °C |
106 µin/in-°F @Temperature 68.0 °F |
ASTM E-831 |
DSM Biomedical PurSil® AL 20 Aliphatic Thermoplastic Silicone Polyether Urethane
(discontinued **) PurSil® AL is a family of aliphatic, thermoplastic silicone polyether urethane copolymers. These polymers are formed by the incorporation of silicone in the polymer backbone together with polyether.. |
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CTE, linear | 190 µm/m-°C @Temperature 20.0 °C |
106 µin/in-°F @Temperature 68.0 °F |
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Humiseal 1C55 Silicone Conformal Coating Humiseal 1C55 Silicone Conformal CoatingHigh temperature resistanceGood dielectrical propertiesGood moisture resistanceRepairableUL Approval PendingMIL-I-46058C Approval PendingPasses thermal shock .. |
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CTE, linear | 190 µm/m-°C | 106 µin/in-°F | Alpha 2 |
Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po.. |
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CTE, linear | 190 µm/m-°C @Temperature 20.0 °C |
106 µin/in-°F @Temperature 68.0 °F |
TMA |
Toyobo PELPRENE™ S1002 Polyester TPE, Ultra Heat-resistant Features: Polyester TPE, Ultra Heat-resistantInformation provided by Toyobo. |
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CTE, linear | 191 µm/m-°C | 106 µin/in-°F | Above Tg |
Tra-Con Tra-Bond F113SC High Tg Fiber Optic Epoxy Adhesive TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lense.. |
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CTE, linear | 191 µm/m-°C | 106 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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CTE, linear | 191 µm/m-°C | 106 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
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CTE, linear | 190 µm/m-°C | 106 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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CTE, linear | 190 µm/m-°C | 106 µin/in-°F | 90 Minute UV Cure; T>Tg; ASTM E831-93 |
3D Systems Accura® SI 40 Plastic for the SLA® 500 System Accura 40 "Ar" or "Hc" type materials - for the SLA 500 system. Mimics Nylon 6:6ApplicationsHigh temperature testing:Under hood bolt-on testingWind tunnel testingHVAC testingPrototyping and testing .. |
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CTE, linear | 190 µm/m-°C @Temperature 20.0 °C |
106 µin/in-°F @Temperature 68.0 °F |
TMA |
Toyobo Pelprene™ S-1001 Polyester TPE Key Feature: Pelprene S typePelprene™ can be processed into a wide variety of articles from ultra-small precision parts to sheets by injection, extrusion, and blow molding. The 'S' type is a block.. |
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CTE, linear | 190 µm/m-°C @Temperature 20.0 °C |
106 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Rochling Engineered Plastics Polystone® Reprocessed (UHMW-PE) Polystone® M is a highly versatile polymer that features: Low coefficient of friction Excellent abrasion resistance High-impact strength Chemical resistance Complies with FDA regulations under the .. |